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ZSSC3036CI1B Datasheet(PDF) 1 Page - Integrated Device Technology |
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ZSSC3036CI1B Datasheet(HTML) 1 Page - Integrated Device Technology |
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1 / 48 page  Low-Power, High-Resolution 16-Bit Sensor Signal Conditioner ZSSC3036 Datasheet © 2016 Integrated Device Technology, Inc. 1 April 20, 2016 Brief Description The ZSSC3036 is a sensor signal conditioner (SSC) integrated circuit for high-accuracy amplification and analog-to-digital conversion of a differential input signal. Designed for high-resolution altimeter module applications, the ZSSC3036 can perform offset, span, and 1 st and 2nd order temperature compen- sation of the measured signal. Developed for correc- tion of resistive bridge sensors, it can also provide a corrected temperature output measured with an internal sensor. The measured and corrected bridge values are provided at the digital output pins, which can be configured as I 2C™* ( ≤ 3.4MHz) or SPI (≤ 20MHz). Digital compensation of signal offset, sensitivity, temperature, and non-linearity is accomplished via an 18-bit internal digital signal processor (DSP) run- ning a correction algorithm. Calibration coefficients are stored on-chip in a highly reliable, non-volatile, multiple-time programmable (MTP) memory. Pro- gramming the ZSSC3036 is simple via the serial interface. The IC-internal charge pump provides the MTP programming voltage. The interface is used for the PC-controlled calibration procedure, which pro- grams the set of calibration coefficients in memory. The ZSSC3036 provides accelerated signal process- ing in order to support high-speed control, safety, and real-time sensing applications. It complements IDT’s additional ZSSC30x6 products. Features • Flexible, programmable analog front-end design; up to 16-bit scalable, charge-balancing two- segment analog-to-digital converter (ADC) • Fully programmable gain amplifier accepting sensors from 14 to 72 (linear factor) • Internal auto-compensated temperature sensor • Digital compensation of individual sensor offset; 1 st and 2nd order digital compensation of sensor gain as well as of 1 st and 2nd order temperature gain and offset drift • Fast sensing: 16-bit conditioned sensor signal measurement rate at more than 200s -1 • Typical sensor elements can achieve accuracy of less than ±0.10% FSO** @ -40 to 110°C Benefits • Integrated 18-bit calibration math DSP • Fully corrected signal at digital output • Layout customized for die-die bonding with sensor for high-density chip-on-board assembly • Single-pass calibration minimizes calibration costs • No external trimming, filter, or buffering com- ponents required • Highly integrated CMOS design • Excellent for low-voltage and low-power battery applications • Optimized for operation in calibrated resistive sensor modules Physical Characteristics • Supply voltage range: 1.8 to 3.6V • Current consumption: 1mA (operating mode) • Sleep State current: 50nA (typical) • Temperature resolution: <0.003K/LSB • Operation temperatures: –40°C to +85°C –40°C to +110°C • Small die size • Delivery options: die for wafer bonding * I 2C™ is a trademark of NXP. ** FSO = Full Scale Output. ZSSC3036 Application Example |
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