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ZSSC3138BA1B Datasheet(PDF) 11 Page - Integrated Device Technology

Part # ZSSC3138BA1B
Description  Sensor Signal Conditioner for Ceramic Sensor Applications
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Manufacturer  IDT [Integrated Device Technology]
Direct Link  http://www.idt.com
Logo IDT - Integrated Device Technology

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ZSSC3138 Datasheet
© 2016 Integrated Device Technology, Inc.
11
January 25, 2016
The digital signal conditioning is processed by the calibration microcontroller (CMC). It is based on a correction
formula that uses sensor-specific coefficients determined during calibration. The formula is located in ROM, and
the sensor-specific coefficients are stored in EEPROM. Depending on the programmed output configuration, the
conditioned sensor signal is output as an analog signal, or alternatively can be readout via a digital serial interface
(I²C™ or ZACwire™). The configuration data and the correction parameters must also be programmed into the
EEPROM via the digital interfaces.
2.2.
Application Modes
For each application, a configuration set must be established by programming the on-chip EEPROM for the
following modes:
Sensor channel
Input range: The gain adjustment of the analog front-end (AFE) with respect to the maximum sensor
signal span and the zero point of the A/D conversion must be selected.
Extended analog offset compensation (XZC): If required, this compensates large sensor offsets; e.g., if
the sensor offset voltage is near to or larger than the sensor span.
Resolution/response time: The A/D converter must be configured for resolution. The ADC order (first or
second order) must also be configured. These settings influence the sampling rate and the signal
integration time, and thus, the noise immunity.
Temperature
Temperature measurement
2.3.
Analog Front-End (AFE)
The analog front-end (AFE) consists of the three-stage programmable gain amplifier (PGA), the multiplexer
(MUX), and the analog-to-digital converter (ADC).


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