Status: Released

Drawing: M.A. Fedde

Scale: 3:1

Rev: B

Date: 12/24/08

File: SG-BGA-6279 Dwg.mcd

SG-BGA-6279 Drawing

Modified: 7/22/09, AE

PAGE 2 of 4

Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise.

Recommended PCB Layout

Top View

Target PCB Recommendations

Total thickness: 1.6mm min.

Plating: Gold or Solder finish

PCB Pad height: Same or higher than solder mask

NOTE: Backing plate may be required based on end user's application

*Note: BGA pattern is not symmetrical

with respect to the mounting holes. It is

offset by 0.375mm to the right of center.

Please adjust PCB layout as per your chip.

Note: Full BGA pattern shown. Please adjust pattern according to individual requirements.

© 2009 IRONWOOD ELECTRONICS, INC.

11351 Rupp Dr. Suite 400, Burnsville MN 55337

Tele: (952) 229-8200

www.ironwoodelectronics.com

Orientation Mark

1.25mm±0.13mm(x4)

1.25mm±0.13mm(x4)

5.08mm

16.225mm (x2)

13.725mm(x2)

0.8mm typ.

Ø 0.36mm pad

4.04mm*

2.54mm

Mounting Hole

Ø 1.61mm±0.05mm (x4)

Alignment Hole

Ø 0.85mm±0.025mm (x2)

2.86mm

24.225mm (x2)

21.725mm (x2)

Socket

Body Size

6.4mm

16mm