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SG-BGA-6279 Datasheet(PDF) 2 Page - Ironwood Electronics. |
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SG-BGA-6279 Datasheet(HTML) 2 Page - Ironwood Electronics. |
2 / 4 page Status: Released Drawing: M.A. Fedde Scale: 3:1 Rev: B Date: 12/24/08 File: SG-BGA-6279 Dwg.mcd SG-BGA-6279 Drawing Modified: 7/22/09, AE PAGE 2 of 4 Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. Recommended PCB Layout Top View Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask NOTE: Backing plate may be required based on end user's application *Note: BGA pattern is not symmetrical with respect to the mounting holes. It is offset by 0.375mm to the right of center. Please adjust PCB layout as per your chip. Note: Full BGA pattern shown. Please adjust pattern according to individual requirements. © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Dr. Suite 400, Burnsville MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Orientation Mark 1.25mm±0.13mm(x4) 1.25mm±0.13mm(x4) 5.08mm 16.225mm (x2) 13.725mm(x2) 0.8mm typ. Ø 0.36mm pad 4.04mm* 2.54mm Mounting Hole Ø 1.61mm±0.05mm (x4) Alignment Hole Ø 0.85mm±0.025mm (x2) 2.86mm 24.225mm (x2) 21.725mm (x2) Socket Body Size 6.4mm 16mm |
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