MBRAF1540T3G, NRVBAF1540T3G

www.onsemi.com

5

PACKAGE DIMENSIONS

SMA−FL

CASE 403AA

ISSUE A

D

E

b

L

c

SOLDER FOOTPRINT*

DIMENSIONS: MILLIMETERS

5.56

1.76

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

1.30

RECOMMENDED

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

DIM

MIN

MAX

MILLIMETERS

A

0.90

1.10

b

1.25

1.65

c

0.15

0.30

D

2.40

2.80

TOP VIEW

E1

BOTTOM VIEW

2X

2X

SIDE VIEW

A

PLANE

E

4.80

5.40

E1

4.00

4.60

L

0.70

1.10

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