F1456 Datasheet

© 2016 Integrated Device Technology, Inc

8

November 9, 2016

Thermal Characteristics

Table 6. Package Thermal Characteristics

Parameter

Symbol

Value

Units

Junction to Ambient Thermal Resistance.

40

°C/W

Junction to Case Thermal Resistance.

(Case is defined as the exposed paddle)

4

°C/W

Moisture Sensitivity Rating (Per J-STD-020)

MSL 1

Typical Operating Conditions (TOC)

Unless otherwise stated the typical operating graphs were measured under the following conditions:

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/STBY = High

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5 MHz Tone Spacing

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Gain setting = Maximum Gain

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All temperatures are referenced to the exposed paddle

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ACLR measurements used with a Basic LTE FDD Downlink 20 MHz TM1.2 Test signal

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EVM measurements used with a Basic LTE FDD Downlink 20 MHz TM3.1 Test signal

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Note TN1: Atten ≤ 4 dB Fixed Pout = 7 dBm per waveform or per tone, Atten > 4 dB Fixed Pin = -21 dBm per waveform or per tone

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Note TN2: Atten ≤ 7 dB Fixed Pout = 10.5 dBm per waveform or per tone, Atten > 7 dB Fixed Pin = -14.5 dBm per waveform or per tone

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Evaluation Kit traces and connector losses are de-embedded