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F2970NCGK8 Datasheet(PDF) 7 Page - Integrated Device Technology |
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F2970NCGK8 Datasheet(HTML) 7 Page - Integrated Device Technology |
7 / 20 page F2970 Datasheet © 2016 Integrated Device Technology, Inc. 7 November 11, 2016 Thermal Characteristics Table 6. Package Thermal Characteristics Parameter Symbol Value Units Junction to Ambient Thermal Resistance. θJA 53 °C/W Junction to Case Thermal Resistance. (Case is defined as the exposed paddle) θJC 13.8 °C/W Moisture Sensitivity Rating (Per J-STD-020) MSL 1 Typical Operating Conditions (TOC) VDD = +3.0 V ZL = ZS = 75Ω TCASE = 25°C FRF = 1200 MHz Small signal parameters measured with PIN = 0 dBm Two tone parameters measured with PIN = 13 dBm/tone Driven Port is RF1 or RF2 All temperatures are referenced to the exposed paddle. Evaluation Kit traces and connector losses are de-embedded. |
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