© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com

C1005_Y5V_SMD • 2/29/2016

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Y5V Dielectric, 6.3 – 50 VDC (Commercial Grade)

Table 4 – Performance & Reliability: Test Methods and Conditions

Stress

Reference

Test or Inspection Method

TerminalStrength

JIS–C–6429

Appendix1,Note:Forceof1.8kgfor60seconds.

Board Flex

JIS–C–6429

Appendix2,Note:Standardterminationsystem–2.0mm(minimum)forallexcept3mmforC0G.

Flexibleterminationsystem–3.0mm(minimum).

Solderability

J–STD–002

Magnification50X.Conditions:

a)MethodB,4hours@155°C,dryheat@235°C

b)MethodB@215°Ccategory3

c)MethodD,category3@260°C

TemperatureCycling

JESD22MethodJA–104

1,000Cycles(−55°Cto+125°C).Measurementat24hours+/-4hoursaftertestconclusion.

BiasedHumidity

MIL–STD–202Method103

LoadHumidity:1,000hours85°C/85%RHandratedvoltage.Add100Kohmresistor.Measurement

at24hours+/-4hoursaftertestconclusion.

LowVoltHumidity:1,000hours85°C/85%RHand1.5V.Add100Kohmresistor.

Measurementat24hours+/-4hoursaftertestconclusion.

MoistureResistance

MIL–STD–202Method106 t=24hours/cycle.Steps7aand7bnotrequired.

Measurementat24hours+/-4hoursaftertestconclusion.

ThermalShock

MIL–STD–202Method107 −55°C/+125°C.Note:Numberofcyclesrequired–300,maximumtransfertime–20seconds,dwell

time–15minutes.Air–Air.

HighTemperatureLife

MIL–STD–202Method108

/EIA–198

1,000hoursat125°C(85°CforX5R,Z5UandY5V)with2Xratedvoltageapplied.

StorageLife

MIL–STD–202Method108 150°C,0VDCfor1,000hours.

Vibration

MIL–STD–202Method204

5g'sfor20min.,12cycleseachof3orientations.Note:Use8"X5"PCB0.031"thick7secure

pointsononelongsideand2securepointsatcornersofoppositesides.Partsmountedwithin2"

fromanysecurepoint.Testfrom10–2,000Hz

MechanicalShock

MIL–STD–202Method213 Figure1ofMethod213,ConditionF.

Resistance to Solvents MIL–STD–202Method215 Addaqueouswashchemical,OKEMCleanorequivalent.

Storage and Handling

Ceramicchipcapacitorsshouldbestoredinnormalworkingenvironments.Whilethechipsthemselvesarequiterobustinother

environments,solderabilitywillbedegradedbyexposuretohightemperatures,highhumidity,corrosiveatmospheres,andlongterm

storage.Inaddition,packagingmaterialswillbedegradedbyhightemperature–reelsmaysoftenorwarpandtapepeelforcemay

increase.KEMETrecommendsthatmaximumstoragetemperaturenotexceed40ºCandmaximumstoragehumiditynotexceed70%

relativehumidity.Temperaturefluctuationsshouldbeminimizedtoavoidcondensationonthepartsandatmospheresshouldbefreeof

chlorineandsulfurbearingcompounds.Foroptimizedsolderabilitychipstockshouldbeusedpromptly,preferablywithin1.5yearsof

receipt.