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C0805C226Z4VACTU Datasheet(PDF) 9 Page - Kemet Corporation |
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C0805C226Z4VACTU Datasheet(HTML) 9 Page - Kemet Corporation |
9 / 18 page © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1005_Y5V_SMD • 2/29/2016 9 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Y5V Dielectric, 6.3 – 50 VDC (Commercial Grade) Table 4 – Performance & Reliability: Test Methods and Conditions Stress Reference Test or Inspection Method TerminalStrength JIS–C–6429 Appendix1,Note:Forceof1.8kgfor60seconds. Board Flex JIS–C–6429 Appendix2,Note:Standardterminationsystem–2.0mm(minimum)forallexcept3mmforC0G. Flexibleterminationsystem–3.0mm(minimum). Solderability J–STD–002 Magnification50X.Conditions: a)MethodB,4hours@155°C,dryheat@235°C b)MethodB@215°Ccategory3 c)MethodD,category3@260°C TemperatureCycling JESD22MethodJA–104 1,000Cycles(−55°Cto+125°C).Measurementat24hours+/-4hoursaftertestconclusion. BiasedHumidity MIL–STD–202Method103 LoadHumidity:1,000hours85°C/85%RHandratedvoltage.Add100Kohmresistor.Measurement at24hours+/-4hoursaftertestconclusion. LowVoltHumidity:1,000hours85°C/85%RHand1.5V.Add100Kohmresistor. Measurementat24hours+/-4hoursaftertestconclusion. MoistureResistance MIL–STD–202Method106 t=24hours/cycle.Steps7aand7bnotrequired. Measurementat24hours+/-4hoursaftertestconclusion. ThermalShock MIL–STD–202Method107 −55°C/+125°C.Note:Numberofcyclesrequired–300,maximumtransfertime–20seconds,dwell time–15minutes.Air–Air. HighTemperatureLife MIL–STD–202Method108 /EIA–198 1,000hoursat125°C(85°CforX5R,Z5UandY5V)with2Xratedvoltageapplied. StorageLife MIL–STD–202Method108 150°C,0VDCfor1,000hours. Vibration MIL–STD–202Method204 5g'sfor20min.,12cycleseachof3orientations.Note:Use8"X5"PCB0.031"thick7secure pointsononelongsideand2securepointsatcornersofoppositesides.Partsmountedwithin2" fromanysecurepoint.Testfrom10–2,000Hz MechanicalShock MIL–STD–202Method213 Figure1ofMethod213,ConditionF. Resistance to Solvents MIL–STD–202Method215 Addaqueouswashchemical,OKEMCleanorequivalent. Storage and Handling Ceramicchipcapacitorsshouldbestoredinnormalworkingenvironments.Whilethechipsthemselvesarequiterobustinother environments,solderabilitywillbedegradedbyexposuretohightemperatures,highhumidity,corrosiveatmospheres,andlongterm storage.Inaddition,packagingmaterialswillbedegradedbyhightemperature–reelsmaysoftenorwarpandtapepeelforcemay increase.KEMETrecommendsthatmaximumstoragetemperaturenotexceed40ºCandmaximumstoragehumiditynotexceed70% relativehumidity.Temperaturefluctuationsshouldbeminimizedtoavoidcondensationonthepartsandatmospheresshouldbefreeof chlorineandsulfurbearingcompounds.Foroptimizedsolderabilitychipstockshouldbeusedpromptly,preferablywithin1.5yearsof receipt. |
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