1

2

Threaded Insert

3.18mm

[0.125"]

0.33mm

[0.013"]

0.80mm

2.54mm

[0.100"]

25.725mm

[1.013"]

20.00mm [0.787"]

30.725mm [1.210"]

3.24mm [0.127"]

2.50mm [0.098"]

20.00mm

[0.787"]

5.08mm

[0.200"]

2.86mm

[0.113"]

2.50mm

[0.098"]

30.725mm

[1.210"]

25.725mm [1.013"]

Ø 0.60mm typ. [Ø 0.024"]

Substrate: 3.18mm ±0.25mm [0.125" ±0.001"] FR4/G10 or

equivalent high temp material. 17µm [1/2 oz.] Cu clad. Au

plating. (RoHS)

Solder ball: Sn96.5Ag3.0Cu0.5

1

2

Ø 0.46mm typ. [Ø 0.018"]

Side View

Top View

Description: BGA Surface Mount Adaptor

676 position surface mount land pattern to solder balls. To be used with GHz sockets.

Status: Released

Drawing: S.Natarajan

Scale: 3:1

Rev: A

Date: 5/17/06

Modified:

File: SF-BGA676D-B-05F Dwg

SF-BGA676D-B-05F Drawing

© 2006 IRONWOOD ELECTRONICS, INC.

11351 Rupp Dr. Suite 400 Burnsville MN 55337

Tele: (952) 229-8200

www.ironwoodelectronics.com

Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)

±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.

RoHS COMPLIANT