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SG-BGA-6115 Datasheet(PDF) 3 Page - Ironwood Electronics. |
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SG-BGA-6115 Datasheet(HTML) 3 Page - Ironwood Electronics. |
3 / 4 page Status: Released Drawing: H. Hansen Scale: - Rev: C Date: 3/19/04 File: SG-BGA-6115 Dwg.mcd SG-BGA-6115 Drawing © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Modified: 11/4/09 PAGE 3 of 4 Array: 29x29 D E Y X Ø0.25 Ø0.10 Z X Y Øb TOP VIEW SIDE VIEW Compatible BGA Spec 0.20 BOTTOM VIEW e DETAIL DIM MIN MAX A 3.67 A1 0.6 b 0.75 D E e 37.50 BSC 37.50 BSC 1.27 BSC 3 4 5 Dimensions are in millimeters. Interpret dimensions and tolerances per ASME Y14.5M-1994. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. Datum Z (seating plane) is defined by the spherical crowns of the solder balls. Parallelism measurement shall exclude any effect of mark on top surface of package. 1. 2. 3 0.5 A A1 DETAIL 0.15 Z Z 0.20 Z 5 4 |
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