SN74LVC1G06

SINGLE INVERTER BUFFER/DRIVER

WITH OPEN-DRAIN OUTPUT

SCES295N – JUNE 2000 – REVISED SEPTEMBER 2003

1

POST OFFICE BOX 655303

NanoStar

 and NanoFree Packages

Voltages Up To 5.5 V

Operation

JESD 78, Class II

– 2000-V Human-Body Model (A114-A)

– 200-V Machine Model (A115-A)

– 1000-V Charged-Device Model (C101)

description/ordering information

NanoStar

 and NanoFree package technology is a major breakthrough in IC packaging concepts, using the

die as the package.

The output of the SN74LVC1G06 device is open drain and can be connected to other open-drain outputs to

implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.

ORDERING INFORMATION

TA

PACKAGE†

ORDERABLE

PART NUMBER

TOP-SIDE

MARKING‡

–40 C to 85 C

NanoStar

 – WCSP (DSBGA)

0.17-mm Small Bump – YEA

Reel of 3000

SN74LVC1G06YEAR

_ _ _CT_

–40 C to 85 C

NanoFree

 – WCSP (DSBGA)

0.17-mm Small Bump – YZA (Pb-free)

Reel of 3000

SN74LVC1G06YZAR

_ _ _CT_

–40 C to 85 C

NanoStar

 – WCSP (DSBGA)

0.23-mm Large Bump – YEP

Reel of 3000

SN74LVC1G06YEPR

_ _ _CT_

–40

°C to 85°C

NanoFree

 – WCSP (DSBGA)

0.23-mm Large Bump – YZP (Pb-free)

SN74LVC1G06YZPR

SOT (SOT-23) – DBV

Reel of 3000

SN74LVC1G06DBVR

C06_

SOT (SOT-23) – DBV

Reel of 250

SN74LVC1G06DBVT

C06_

SOT (SC-70) – DCK

Reel of 3000

SN74LVC1G06DCKR

CT_

SOT (SC-70) – DCK

Reel of 250

SN74LVC1G06DCKT

CT_

† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

‡ DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.

YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,

and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition

(1 = SnPb,

Copyright

 2003, Texas Instruments Incorporated

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

NanoStar and NanoFree are trademarks of Texas Instruments.

DBV OR DCK PACKAGE

(TOP VIEW)

1

2

3

5

4

NC

A

GND

Y

DNU – Do not use

3

2

1

4

5

GND

A

DNU

Y

YEA, YEP, YZA, OR YZP PACKAGE

(BOTTOM VIEW)

NC – No internal connection

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.