SURFACE MOUNT LED LAMPS

Low Current Type (IF≦10mA) Mini-molded chip LEDs

SML512 Series

(Typ.)

The recommended thickness of the screen mask

for soldering is between 100 and 200μm. The

hole size of the screen mask should be same as

the recommended land pattern or smaller.

1608

(0603)

1.6

×0.8

t=0.55

Relative INTENSITY (

%)

0

50

100

50

100

0

°

30

°

60

°

90

°

30

°

60

°

90

°

100

(mA)

Typ.

(V)

Typ.

(mcd)

Typ.

(nm)

λp

Typ.

(nm)

Min.

(

(mA)

(mA)

Max.

(

µA)

Transparent Clear

Note) "-" will be taken out for emitting color B series.

-30 to +85

Tolerance:

±0.1

(V)

∆λ

0.8

Feeding direction

2

4

φ1.5

1

0.73

φ13

φ60

φ180

Package Size

（mm）

Tape Spacifications：T86〈3,000pcs／reel〉

Reel Spacifications

Blue

InGaN on SiC

SML512BC4T

Blue

74

20

5

-40 to +100

SML512BC4T

2.9

5

5

468

5.6

14

26

55

SCANNING ANGLE (deg)

1.0

Electrode

Cathode index

1.2

（0.25）

Chip Center Position

1.6

（Unit：mm）

Y’

X’

Peak

forward

current

（mA）

Part No.

Power

dissipation

（mW）

Forward

current

（mA）

Reverse

voltage

（V）

Operating

temperature

（

°C）

Stotage

temperature

（

°C）

Emitting

color

Part No.

Forward

voltage

Light wavelength

Reverse

current

Brightness

Resin Color

Peak Half-wave

468nm

SML512BC4T