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SG-BGA-6167 Datasheet(PDF) 3 Page - Ironwood Electronics. |
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SG-BGA-6167 Datasheet(HTML) 3 Page - Ironwood Electronics. |
3 / 3 page PAGE 3 of 3 Status: Released Drawing: Nidhi Sen Scale: 6:1 Rev: B Date: 06/26/06 File: SG-BGA-6167 Dwg SG-BGA-6167 Drawing Modified: 6/12/09, AE © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com D E Ø b e Ø0.25 Ø0.10 X Y X Y Compatible BGA Spec. Top View Bottom View Side View 3 4 5 Dimensions are in millimeters. Interpret dimensions and tolerances per ASME Y14.5M-1994. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. Datum Z (seating plane) is defined by the spherical crowns of the solder balls. Parallelism measurement shall exclude any effect of mark on top surface of package. 1. 2. DIM MIN MAX A 1.2 A1 b 0.43 D E e 1.0 BSC 0.25 10.0 BSC 13.0 BSC Array: 8 x 8 3 A1 0.12 Z A 0.20 Z Z 4 5 |
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