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LP2985IBLX-1.8 Datasheet(PDF) 5 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Part # LP2985IBLX-1.8
Description  Micropower 150 mA Low-Noise Low-Dropout Regulator in SOT-23 and micro SMD packages for Applications
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Manufacturer  NSC [National Semiconductor (TI)]
Direct Link  http://www.national.com
Logo NSC - National Semiconductor (TI)

LP2985IBLX-1.8 Datasheet(HTML) 5 Page - National Semiconductor (TI)

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Electrical Characteristics (Note 10) (Continued)
Limits in standard typeface are for T
J = 25˚C. and limits in boldface type apply over the full operating temperature range. Un-
less otherwise specified: V
IN =VO(NOM) + 1V, IL = 1 mA, CIN = 1 µF, COUT = 4.7 µF, VON/OFF = 2V.
Symbol
Parameter
Conditions
Typ
LP2985AI-X.X
LP2985I-X.X
Units
(Note 6)
(Note 6)
Min
Max
Min
Max
Ripple Rejection
f = 1 kHz, C
BYPASS =10nF
45
dB
C
OUT =10µF
I
O(SC)
Short Circuit Current
R
L = 0 (Steady State)
400
mA
(Note 8)
I
O(PK)
Peak Output Current
V
OUT
≥ V
o(NOM) −5%
350
mA
Note 1: “Absolute Maximum Ratings” indicate limits beyond which damage to the component may occur. Electrical specifications do not apply when operating the
device outside of its rated operating conditions.
Note 2: The ESD rating of pins 3 and 4 for the SOT-23 package, or pins 5 and 2 for the micro SMD package, is 1 kV.
Note 3: The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to-ambient thermal resistance, θJ-A,
and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperture is calculated using:
Where the value of
θJ-A for the SOT-23 package is 220˚C/W in a typical PC board mounting. Exceeding the maximum allowable dissipation will cause excessive die
temperature, and the regulator will go into thermal shutdown.
Note 4: If used in a dual-supply system where the regulator load is returned to a negative supply, the LP2985LV output must be diode-clamped to ground.
Note 5: The output PNP structure contains a diode between the VIN to VOUT terminals that is normally reverse-biased. Reversing the polarity from VIN to VOUT will
turn on this diode, and possibly damage the device (See Application Hints).
Note 6: Limits are 100% production tested at 25˚C. Limits over the operating temperature range are guaranteed through correlation using Statistical Quality Control
(SQC) methods. The limits are used to calculate National’s Average Outgoing Quality Level (AOQL).
Note 7: The ON/OFF input must be properly driven to prevent possible misoperation. For details, refer to Application Hints.
Note 8: The LP2985LV has foldback current limiting which allows a high peak current when VOUT > 0.5V, and then reduces the maximum output current as VOUT
is forced to ground (see Typical Performance Characteristics curves).
Note 9: VIN must be the greater of 2.2V or VOUT(nom) + Dropout Voltage to maintain output regulation. Dropout Voltage is defined as the input to output differential
at which the output voltage drops 2% below ther value measured with a 1V differential.
Note 10: Exposing the micro SMD device to direct sunlight will cause misoperation. See Application Hints for additional information.
www.national.com
5


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