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2 / 28 page IQ Switch ® ProxSense ® Series Copyright © Azoteq (Pty) Ltd 2015 IQS316 Datasheet Page 2 of 28 All rights reserved. Revision 1.03 November 2015 Contents IQS316 Datasheet ...........................................................1 1 Overview................................................................3 2 Packaging and Pin-out ............................................4 2.1 QFN32............................................................... 4 2.2 ICTRL................................................................. 5 3 ProxSense ® Module ................................................5 3.1 Charge Transfer Concepts ................................ 5 3.2 Charging Modes ............................................... 6 3.2.1 Prox Mode Charging .................................... 6 3.2.2 Touch Mode Charging.................................. 6 3.2.3 Interaction Between Prox and Touch Mode 7 3.2.4 Low Power Charging .................................... 7 3.3 Prox Module Setup ........................................... 8 3.3.1 Report rate................................................... 8 3.3.2 Transfer Frequency ...................................... 8 3.3.3 Count Value.................................................. 8 3.3.4 Prox Mode Channel Filters........................... 8 3.3.5 Environmental Drift ..................................... 8 3.3.6 LTA Filter ...................................................... 8 3.3.7 Filter Halt ..................................................... 8 3.3.8 Touch Sensitivity (Touch Mode channels only) 9 3.3.9 Proximity Sensitivity (Prox and Touch Mode channels)................................................................... 9 3.3.10 Antenna Tuning Implementation ............ 9 4 Additional Features .............................................. 10 4.1 RF Immunity ................................................... 10 4.1.1 Design Guidelines....................................... 10 4.1.2 RF detection ............................................... 10 4.2 Active Shield ................................................... 10 4.3 Proximity Output (POUT)................................ 11 4.4 Zero Cross Synchronising ................................ 11 4.5 Device Sleep.................................................... 11 4.6 Communication Bypass .................................. 11 4.7 General Purpose I/O’s .................................... 12 5 Application Design ............................................... 12 5.1 Physical Layout............................................... 12 5.2 Cx Selection .................................................... 12 5.2.1 Cx Sensor Close to Noise Source................ 12 5.2.2 Cx Sensors Requiring Shield ....................... 12 5.2.3 Cx Sensors Used For Prox........................... 12 5.2.4 Cx Sensors plus I/O’s.................................. 13 5.2.5 Unused Cx’s................................................ 13 6 Communication ....................................................13 6.1 Communication Selection............................... 13 6.2 Watchdog Timeout and MCLR ....................... 13 6.3 SPI................................................................... 13 6.3.1 SPI read ...................................................... 14 6.3.2 SPI write ..................................................... 14 6.3.3 SPI Communications Window Terminate Command................................................................ 15 6.4 I 2C ................................................................... 15 6.4.1 Control byte and Device Address............... 15 6.4.2 I 2C read....................................................... 15 6.4.3 I 2C write ..................................................... 15 6.4.4 I 2C Communications Window Terminate Command................................................................ 16 6.5 Circuit diagrams (all features) ........................ 16 7 Electrical specifications.........................................18 7.1 Absolute maximum specifications.................. 18 7.2 Operating conditions (Measured at 25°C)...... 18 7.3 Moisture Sensitivity Level ............................... 18 7.4 Recommended storage environment for IC’s . 19 7.5 Timing characteristics (Measured at 25°C) .... 20 8 Mechanical Dimensions ........................................21 8.1 IQS316 Mechanical Dimensions ..................... 21 8.1.2 QFR package differences to QNR package. 22 8.2 IQS316 Landing Pad Layout............................ 23 9 Datasheet and Part-number Information .............24 9.1 Ordering Information ..................................... 24 9.2 Package Marking............................................ 24 9.3 Tape and Reel................................................. 25 9.5 Revision History .............................................. 27 Appendix A. Contact Information.............................28 |
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