IQS3160QNR datasheet(2/28 Pages) ETC2

Part #	IQS3160QNR

Description	16 Touch Keys with distributed Proximity Sensing

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IQ Switch

®

ProxSense

® Series

IQS316 Datasheet

Page 2 of 28

Revision 1.03

November 2015

Contents

IQS316 Datasheet ...........................................................1

1

Overview................................................................3

2

Packaging and Pin-out ............................................4

2.1

QFN32............................................................... 4

2.2

ICTRL................................................................. 5

3

ProxSense

® Module ................................................5

3.1

Charge Transfer Concepts ................................ 5

3.2

Charging Modes ............................................... 6

3.2.1

Prox Mode Charging .................................... 6

3.2.2

Touch Mode Charging.................................. 6

3.2.3

Interaction Between Prox and Touch Mode 7

3.2.4

Low Power Charging .................................... 7

3.3

Prox Module Setup ........................................... 8

3.3.1

Report rate................................................... 8

3.3.2

Transfer Frequency ...................................... 8

3.3.3

Count Value.................................................. 8

3.3.4

Prox Mode Channel Filters........................... 8

3.3.5

Environmental Drift ..................................... 8

3.3.6

LTA Filter ...................................................... 8

3.3.7

Filter Halt ..................................................... 8

3.3.8

Touch Sensitivity (Touch Mode channels

only)

9

3.3.9

Proximity Sensitivity (Prox and Touch Mode

channels)................................................................... 9

3.3.10

Antenna Tuning Implementation ............ 9

4

Additional Features .............................................. 10

4.1

RF Immunity ................................................... 10

4.1.1

Design Guidelines....................................... 10

4.1.2

RF detection ............................................... 10

4.2

Active Shield ................................................... 10

4.3

Proximity Output (POUT)................................ 11

4.4

Zero Cross Synchronising ................................ 11

4.5

Device Sleep.................................................... 11

4.6

Communication Bypass .................................. 11

4.7

General Purpose I/O’s .................................... 12

5

Application Design ............................................... 12

5.1

Physical Layout............................................... 12

5.2

Cx Selection .................................................... 12

5.2.1

Cx Sensor Close to Noise Source................ 12

5.2.2

Cx Sensors Requiring Shield ....................... 12

5.2.3

Cx Sensors Used For Prox........................... 12

5.2.4

Cx Sensors plus I/O’s.................................. 13

5.2.5

Unused Cx’s................................................ 13

6

Communication ....................................................13

6.1

Communication Selection............................... 13

6.2

Watchdog Timeout and MCLR ....................... 13

6.3

SPI................................................................... 13

6.3.1

SPI read ...................................................... 14

6.3.2

SPI write ..................................................... 14

6.3.3

SPI Communications Window Terminate

Command................................................................ 15

6.4

I

2C ................................................................... 15

6.4.1

Control byte and Device Address............... 15

6.4.2

I

2C read....................................................... 15

6.4.3

I

2C write ..................................................... 15

6.4.4

I

2C Communications Window Terminate

Command................................................................ 16

6.5

Circuit diagrams (all features) ........................ 16

7

Electrical specifications.........................................18

7.1

Absolute maximum specifications.................. 18

7.2

Operating conditions (Measured at 25°C)...... 18

7.3

Moisture Sensitivity Level ............................... 18

7.4

Recommended storage environment for IC’s . 19

7.5

Timing characteristics (Measured at 25°C) .... 20

8

Mechanical Dimensions ........................................21

8.1

IQS316 Mechanical Dimensions ..................... 21

8.1.2

QFR package differences to QNR package. 22

8.2

IQS316 Landing Pad Layout............................ 23

9

Datasheet and Part-number Information .............24

9.1

Ordering Information ..................................... 24

9.2

Package Marking............................................ 24

9.3

Tape and Reel................................................. 25

9.5

Revision History .............................................. 27

Appendix A.

Contact Information.............................28

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