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LM62BIM3 Datasheet(PDF) 5 Page - National Semiconductor (TI) |
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LM62BIM3 Datasheet(HTML) 5 Page - National Semiconductor (TI) |
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5 / 7 page  1.0 Mounting (Continued) The table shown in Figure 3 summarizes the rise in die tem- perature of the LM62 without any loading, and the thermal resistance for different conditions. 2.0 Capacitive Loads The LM62 handles capacitive loading well. Without any spe- cial precautions, the LM62 can drive any capacitive load as shown in Figure 4. Over the specified temperature range the LM62 has a maximum output impedance of 4.7 k Ω.Inanex- tremely noisy environment it may be necessary to add some filtering to minimize noise pickup. It is recommended that 0.1 µF be added from +V S to GND to bypass the power sup- ply voltage, as shown in Figure 5. In a noisy environment it may be necessary to add a capacitor from the output to ground. A 1 µF output capacitor with the 4.7 k Ω maximum output impedance will form a 34 Hz lowpass filter. Since the thermal time constant of the LM62 is much slower than the 30 ms time constant formed by the RC, the overall response time of the LM62 will not be significantly affected. For much larger capacitors this additional time lag will increase the overall response time of the LM62. SOT-23 SOT-23 no heat sink small heat fin (Note 13) (Note 12) θ JA T J −TA θ JA T J −TA (˚C/W) (˚C) (˚C/W) (˚C) Still air 450 0.17 260 0.1 Moving air 180 0.07 Note 12: Heat sink used is 1⁄2" square printed circuit board with 2 oz. foil with part attached as shown in Figure 2 . Note 13: Part soldered to 30 gauge wire. FIGURE 3. Temperature Rise of LM62 Due to Self-Heating and Thermal Resistance ( θ JA) DS100893-15 FIGURE 4. LM62 No Decoupling Required for Capacitive Load DS100893-16 FIGURE 5. LM62 with Filter for Noisy Environment DS100893-17 FIGURE 6. Simplified Schematic www.national.com 5 |
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Similar Description - LM62BIM3 |
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