ZSPM9000 Datasheet

© 2016 Integrated Device Technology, Inc.

24

January 27, 2016

4.2.

Pin Description

Pin

Name

Description

1

SMOD#

When SMOD#=HIGH, the low-side driver is the inverse of PWM input. When SMOD#=LOW,

the low-side driver is disabled. This pin has a 10µA internal pull-up current source. Do not add

a noise filter capacitor.

2

VCIN

Linear regulator 5V output. Minimum 1µF X5R/X7R ceramic capacitor to CGND is required.

3

VDRV

Linear regulator input. Minimum 1µF X5R/X7R ceramic capacitor to CGND is required.

4

BOOT

Bootstrap supply input. Provides voltage supply to the high-side MOSFET driver. Connect a

bootstrap capacitor from this pin to PHASE.

5, 37, 41

CGND

Ground return for driver IC.

6

GH

Gate high. For manufacturing test only. This pin must float: it must not be connected.

7

PHASE

Switch node pin for bootstrap capacitor routing; electrically shorted to VSWH pin.

8

NC

No connection. The pin is not electrically connected internally but can be connected to VIN for

convenience.

9 - 14, 42

VIN

Input power voltage (output stage supply voltage).

15, 29 - 35, 43

VSWH

Switch node. Provides return for high-side bootstrapped driver and acts as a sense point for

the adaptive shoot-through protection.

16 – 28

PGND

Power ground (output stage ground). Source pin of the low-side MOSFET.

36

GL

Gate low. For manufacturing test only. This pin must float. It must not be connected.

38

THWN#

Thermal warning flag, open collector output. When temperature exceeds the trip limit, the

output is pulled LOW. THWN# does not disable the module.

39

DISB#

Output disable. When LOW, this pin disables the power MOSFET switching (GH and GL are

held LOW). This pin has a 10µA internal pull-down current source. Do not add a noise filter

capacitor.

40

PWM

PWM signal input. This pin accepts a tri-state 3.3V PWM signal from the controller.