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OPA693IDBVR Datasheet(PDF) 2 Page - Burr-Brown (TI) |
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OPA693IDBVR Datasheet(HTML) 2 Page - Burr-Brown (TI) |
2 / 25 page OPA693 2 SBOS285 www.ti.com SPECIFIED PACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT PRODUCT PACKAGE-LEAD DESIGNATOR(1) RANGE MARKING NUMBER MEDIA, QUANTITY OPA693 SO-8 D –40 °C to +85°C OPA693D OPA693ID Rails, 100 "" " " " OPA693IDR Tape and Reel, 2500 OPA693 SOT23-6 DBV –40 °C to +85°C C59 OPA693IDBVT Tape and Reel, 250 "" " " " OPA693IDBVR Tape and Reel, 3000 NOTE: (1) For the most current specifications and package information, refer to our web site at www.ti.com. ABSOLUTE MAXIMUM RATINGS(1) Power Supply ............................................................................... ±6.5V DC Internal Power Dissipation(2) ............................ See Thermal Information Differential Input Voltage .................................................................. ±1.2V Input Voltage Range ............................................................................ ±V S Storage Temperature Range: D, DVB ........................... –40 °C to +125°C Lead Temperature (soldering, 10s) .............................................. +300 °C Junction Temperature (TJ ) ........................................................... +150°C ESD Rating (Human Body Model) .................................................. 2000V (Charge Device Model) ............................................... 1000V (Machine Model) ............................................................ 100V NOTES:: (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. (2) Packages must be derated based on specified θ JA. Maximum TJ must be observed. ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Texas Instru- ments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degrada- tion to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PIN CONFIGURATION Top View SO Top View SOT23 PACKAGE/ORDERING INFORMATION 1 2 3 4 8 7 6 5 DIS +V S Output NC RF 300 Ω RG 300 Ω NC −IN +IN −V S NC = No Connection 1 2 3 6 5 4 Output −V S +IN +V S DIS −IN R F 300 Ω R G 300 Ω 12 3 65 4 Pin Orientation/Package Marking C59 |
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