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SG-BGA-6004 Datasheet(PDF) 3 Page - Ironwood Electronics. |
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SG-BGA-6004 Datasheet(HTML) 3 Page - Ironwood Electronics. |
3 / 3 page Status: Released Drawing: Meghann Fedde Scale: - Rev: F Date: 8/16/01 File: SG-BGA-6004 Dwg.mcd SG-BGA-6004 Drawing © 2009 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com Modified: 7/02/09, AE PAGE 3 of 3 D E e Y X Ø0.25 Ø0.10 Z X Y Øb 3 4 5 DETAIL TOP VIEW BOTTOM VIEW SIDE VIEW 3 4 5 Dimensions are in millimeters. Interpret dimensions and tolerances per ASME Y14.5M-1994. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. Datum Z (seating plane) is defined by the spherical crowns of the solder balls. Parallelism measurement shall exclude any effect of mark on top surface of package. DIM MIN MAX A 2.5 A1 0.2 0.34 b 0.45 D E e 15.00 BSC 15.00 BSC 0.80 BSC Compatible BGA Spec 0.20 Array 17x17 2 1 A A1 DETAIL 0.1 Z Z 0.20 Z |
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