1.27mm

0.050"

0.66mm

[0.026"]

2.37mm

[0.093"]

38.10mm

[1.500"]

3.03mm

[0.119"]

40.00mm

[1.575"]

40.00mm

[1.575"]

0.95mm

[0.037"]

0.95mm

[0.037"]

Description: Giga-snaP BGA SMT Foot

961 position (1.27mm pitch) gold plated female receptacle pins to SMT solder balls (BGA type). Pin asignment 1:1.

Status: Released

Drawing: S.Natarajan

Scale: 3:1

Rev: B

Date: 6/16/05

Modified: 1/23/06

File: SF-BGA961A-B-32 Dwg

SF-BGA961A-B-32(F) Drawing

© 2005 IRONWOOD ELECTRONICS, INC.

PO BOX 21151 ST. PAUL, MN 55121

Tele: (651) 452-8100

www.ironwoodelectronics.com

1

Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]

FR4/G10 or equivalent high temp material. (RoHS)

2

Top View

Side View

Pins: material- Brass Alloy 360 1/2 hard; finish-

0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).

3

Contacts: Beryllium Copper Alloy172, HT; Finish-

0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).

Patent Pending

4

Solder Balls (See table above)

CONTACT DATA

Accepts 0.20mm - 0.33mm Diameter pins

3-finger

37/25 gram, Initial insertion force (with 0.254mm/0.203mm dia. pin)

30/22 gram, normal force (with 0.254mm/0.203mm dia. pin)

20/17 gram, extraction force (with 0.254mm0.203mm dia. pin)

1

4

2

3

Ordering Information:

Solder Ball Alloy

Part Number Suffix

Sn63Pb37

*RoHS Compliant

-32

Sn96.5Ag3.0Cu0.5

-32F*

Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.18mm [±0.007"], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)

±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.

Detail A

Detail A

1.33mm

[0.052"]

2.37mm

[0.093"]