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R1511J050C-T1-FE Datasheet(PDF) 5 Page - RICOH electronics devices division |
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R1511J050C-T1-FE Datasheet(HTML) 5 Page - RICOH electronics devices division |
5 / 20 page R1511x 5 Power Dissipation (HSOP-6J) This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board. This specification is based on the measurement at the condition below: Measurement Conditions High Wattage Land Pattern Standard Land Pattern Environment Mounting on Board (Wind velocity=0m/s) Mounting on Board (Wind velocity=0m/s) Board Material Glass cloth epoxy plastic (Double-sided) Glass cloth epoxy plastic (Double-sided) Board Dimensions 50mm * 50mm * 1.6mm 50mm * 50mm * 1.6mm Copper Ratio 90% 50% Through-hole φ0.5mm * 44pcs φ0.5mm * 44pcs Measurement Result (Ta=25 °C) High Wattage Land Pattern Standard Land Pattern Free Air Power Dissipation 2000mW 1700mW 540mW Thermal Resistance 50 °C/W 59 °C/W 185 °C/W 0 200 400 600 800 1000 1200 1400 1600 1800 2000 2200 2400 2600 0 25 50 75 100 125 150 Ta (°C) 540 1700 2000 105 単体宙吊り On Board (High Wattage Land Pattern) On Board (Standard Land Pattern) Free Air Power Dissipation High Wattage Standard Measurement Board Pattern IC Mount Area Unit: mm 18 50 50 20 |
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