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AIC1731-13GV Datasheet(PDF) 10 Page - Analog Intergrations Corporation |
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AIC1731-13GV Datasheet(HTML) 10 Page - Analog Intergrations Corporation |
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10 / 12 page  AIC1731 10 The maximum power dissipation is: JA A max - J MAX R θ ) T - (T P = Where TJ-max is the maximum allowable junction temperature (125 °C), and T A is the ambient temperature suitable in application. As a general rule, the lower temperature is, the better reliability of the device is. So the PCB mounting pad should provide maximum thermal conductivity to maintain low device temperature. GND pin performs a dual function for providing an electrical connection to ground and channeling heat away. Therefore, connecting the GND pin to ground with a large pad or ground plane would increase the power dissipation and reduce the device temperature. |
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