RP171x

NO.EA-245-160324

7

PACKAGE INFORMATION

measurement at the condition below:

Measurement Conditions:

Standard Land Pattern

Environment

Mounting on Board (Wind velocity=0m/s)

Board Material

Glass cloth epoxy plastic (Double Layers)

Board Dimensions

40mm

 40mm  1.6mm

Copper Ratio

Top side: Approx. 50%, Back side: Approx. 50%

Through-hole

0.5mm  44pcs

Measurement Results:

(Ta=25

C)

Standard Land Pattern

Free Air

Power Dissipation

380mW (Tjmax=125

C)

475mW (Tjmax=150

C)

150mW

Thermal Resistance

ja=(125-25C)/0.38W=263C/W

ja=(125-25C)/0.15W=667C/W

jc=75C/W

-

0

100

200

300

400

500

600

0

25

50

75

100

125

150

Ambient Temperature (°C)

150

380

85

Free Air

On Board

475

Power Dissipation

Measurement Board Pattern

IC Mount Area (Unit: mm)

40

The above graph shows the Power Dissipation of the package under the conditions of Tjmax=125

C and

Tjmax=150

C.

The operation of the IC within the shaded range in the graph might have an affect on the IC’s lifetime. The

operation time of the IC must be remained within the time limit described in the table below.

Operating Time

Estimated Years

(Operating 4 hours/day)

13,000 hours

9 years