RP114x

NO. EA-236-160824

11

Power Dissipation (SC-88A)

Measurement Conditions below.

Measurement Conditions

Standard Land Pattern

Environment

Mounting on Board (Wind Velocity=0m/s)

Board Material

Glass Cloth Epoxy Plastic (Double-sided)

Board Dimensions

40mm

× 40mm × 1.6mm

Copper Ratio

Top-side: Approx. 50%, Back-side: Approx. 50%

Through-hole

φ0.5mm × 44pcs

Measurement Result

(Ta=25

°C, Tjmax=125°C)

Standard Land Pattern

Free Air

Power Dissipation

380mW

150mW

Thermal Resistance

θja＝(125-25°C)/0.38W＝263°C/W

θja＝(125-25°C)/0.15W＝667°C/W

θjc＝75°C/W

-

Power Dissipation

Note: The above graph shows the power dissipation of the package based on Tjmax=125ºC and Tjmax=150ºC.

Operating the IC within the shaded area in the graph might have an influence on its lifetime.

Operating time must be within the time limit described in the table below.

Operating Time

Estimated Years

(Operating 4 hrs/ day)

13,000 hours

9 Years