Philips Semiconductors

Product specification

TrenchMOS

™ transistor

BUK7606-55A

Standard level FET

MECHANICAL DATA

Fig.19. SOT404 surface mounting package. Centre pin connected to mounting base.

Notes

1. This product is supplied in anti-static packaging. The gate-source input must be protected against static

discharge during transport or handling.

2. Refer to SMD Footprint Design and Soldering Guidelines, Data Handbook SC18.

3. Epoxy meets UL94 V0 at 1/8".

UNIT

A

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

mm

A1

D1

D

E

eLp

HD

Q

c

2.54

2.60

2.20

15.4

14.8

2.9

2.1

9.65

8.65

1.6

1.2

10.3

9.7

4.5

4.1

1.40

1.27

0.85

0.60

0.64

0.46

b

DIMENSIONS (mm are the original dimensions)

SOT404

97-06-16

0

2.5

5 mm

scale

Plastic single-ended package (Philips version of D2-PAK); 2 leads

SOT404

e

e

E

b

D1

HD

D

Q

Lp

c

A1

A

January 1999

6

Rev 1.000