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TBU-PL050-xxx-WH Datasheet(PDF) 1 Page - Bourns Electronic Solutions |
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TBU-PL050-xxx-WH Datasheet(HTML) 1 Page - Bourns Electronic Solutions |
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1 / 7 page  Features n Superiorcircuitprotection n Overcurrent&overvoltageprotection n Blockssurgesuptoratedlimits n High-speedperformance n SmallSMTpackage n RoHScompliant* n Agencyrecognition: Applications n SLICprotection n Cable&DSL n MDU/MTUmodems n ONT n Voice/DSLlinecards TBU-PL Series - TBU® High-Speed Protectors *RoHSDirective2002/95/ECJan.27,2003includingannexandRoHSRecast2011/65/EUJune8,2011. Specificationsaresubjecttochangewithoutnotice. Thedevicecharacteristicsandparametersinthisdatasheetcananddovaryindifferentapplicationsandactualdeviceperformancemayvaryovertime. Usersshouldverifyactualdeviceperformanceintheirspecificapplications. General Information The TBU-PL Series of Bourns® TBU® products are low capacitance dual bidirectional high-speed protection components, constructed using MOSFET semiconductor technology, and designed to protect against faults caused by short circuits, AC power cross, induction and lightning surges. In addition to overcurrent protection, an added feature is the voltage monitoring on the two lines. If the voltage on the line drops below Vss then the voltage will trigger the device to switch to the blocking state. The TBU® high-speed protector placed in the system circuit will monitor the current with the MOSFET detec- tion circuit triggering to provide an effective barrier behind which sensitive electronics will not be exposed to large voltages or currents during surge events. The TBU® device is provided in a surface mount DFN package and meets industry standard requirements such as RoHS and Pb Free solder reflow profiles. Agency Approval TBU® Device Line 1 SLIC Line 1 Line 2 SLIC Line 2 Vdd Vss Description UL File Number: E315805 Industry Standards (in Conjunction with OVP Device) Absolute Maximum Ratings (@ TA = 25 °C Unless Otherwise Noted) Symbol Parameter Part Number Value Unit Vimp Peak impulse voltage withstand with duration less than 10 ms TBU-PL050-xxx-WH TBU-PL060-xxx-WH TBU-PL075-xxx-WH TBU-PL085-xxx-WH 500 600 750 850 V Vrms Continuous A.C. RMS voltage TBU-PL050-xxx-WH TBU-PL060-xxx-WH TBU-PL075-xxx-WH TBU-PL085-xxx-WH 300 350 400 425 V Top Operating temperature range -55 to +125 °C Tstg Storage temperature range -65 to +150 °C Tjmax Maximum Junction Temperature +125 °C ESD HBM ESD Protection per IEC 61000-4-2 on line pads ±2 kV Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted) Symbol Parameter Part Number Min. Typ. Max. Unit Itrigger Current required for the device to go from operating state to protected state TBU-PLxxx-100-WH TBU-PLxxx-200-WH 100 200 150 300 200 400 mA Rdevice Series resistance of the TBU® device 40 50 55 Ω Rmatch Package resistance matching of the TBU® device #1 - TBU® device #2 ±0.5 ±1.0 Ω tblock Time taken for the device to go into current limiting 1 µs IQ Current through the triggered TBU® device with 50 Vdc circuit voltage 0.25 0.70 1.50 mA Iss Operating current with Vss = -50 V 100 µA Vreset Voltage below which the triggered TBU® device will transition to normal operating state TBU-PLxxx-100-WH Forward Mode 12 15 22 V Reverse Mode 10 13 20 TBU-PLxxx-200-WH Forward Mode 15 20 25 Reverse Mode 12 17 22 Vto Voltage threshold offset with 60 Hz applied voltage, with Vss -50 V (Vss - VlineSLIC) -1.0 0.2 V Vss Operating voltage range relative to Vdd -180 -20 V Rth(j-l) One side junction to package pads - FR4 using minimum recommended pad layout 110 °C/W Rth(j-l) Both sides junction to package pads - FR4 using minimum recommended pad layout 65 °C/W Rth(j-l) One side junction to package pads - FR4 using heat sink on board (6 cm2) (0.5 in.2) 70 °C/W Rth(j-l) Both sides junction to package pads - FR4 using heat sink on board (6 cm2) (0.5 in.2) 40 °C/W Solutions available for GR-1089-CORE, ITU-T and a combination of both. |
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Similar Description - TBU-PL050-xxx-WH |
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