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LM5000 Datasheet(PDF) 5 Page - National Semiconductor (TI) |
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LM5000 Datasheet(HTML) 5 Page - National Semiconductor (TI) |
5 / 18 page Electrical Characteristics (Continued) Specifications in standard type face are for T J = 25˚C and those with boldface type apply over the full Operating Tempera- ture Range (T J = −40˚C to +125˚C) Unless otherwise specified. VIN = 12V and IL = 0A, unless otherwise specified. Symbol Parameter Conditions Min (Note 7) Typ (Note 8) Max (Note 7) Units θ JA Thermal Resistance TSSOP, Package only 150 ˚C/W LLP, Package only 45 Note 4: Absolute maximum ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions for which the device is intended to be functional, but device parameter specifications may not be guaranteed. For guaranteed specifications and test conditions, see the Electrical Characteristics. Note 5: The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to-ambient thermal resistance, θJA, and the ambient temperature, TA. See the Electrical Characteristics table for the thermal resistance of various layouts. The maximum allowable power dissipation at any ambient temperature is calculated using: PD (MAX) = (TJ(MAX) −TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Note 6: The human body model is a 100 pF capacitor discharged through a 1.5k Ω resistor into each pin. The machine model is a 200pF capacitor discharged directly into each pin. Note 7: All limits guaranteed at room temperature (standard typeface) and at temperature extremes (bold typeface). All room temperature limits are 100% production tested. All limits at temperature extremes are guaranteed via correlation using standard Statistical Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL). Note 8: Typical numbers are at 25˚C and represent the most likely norm. Note 9: Bias current flows into FB pin. Note 10: Supply voltage, bias current product will result in aditional device power dissipation. This power may be significant. The thermal dissipation design should take this into account. www.national.com 5 |
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