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JANSH2N7262 Datasheet(PDF) 3 Page - International Rectifier

Part # JANSH2N7262
Description  REPETITIVE AVALANCHE AND dv/dt RATED HEXFET TRANSISTOR
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Manufacturer  IRF [International Rectifier]
Direct Link  http://www.irf.com
Logo IRF - International Rectifier

JANSH2N7262 Datasheet(HTML) 3 Page - International Rectifier

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IRHF7230, IRHF8230,JANSR-,JANSH-,2N7262 Devices
www.irf.com
3
Radiation Performance of Rad Hard HEXFETs
Table 1. Low Dose Rate
† ‡
IRHF7230
IRHF8230
Parameter
100K Rads (Si) 1000K Rads (Si)
Units
Test Conditions
‰
Min
Max
Min
Max
BVDSS
Drain-to-Source Breakdown Voltage
200
200
V
VGS = 0V, ID = 1.0mA
VGS(th)
Gate Threshold Voltage
…
2.0
4.0
1.25
4.5
VGS = VDS, ID = 1.0mA
IGSS
Gate-to-Source Leakage Forward
100
100
nA
VGS = 20V
IGSS
Gate-to-Source Leakage Reverse
-100
-100
VGS = -20 V
IDSS
Zero Gate Voltage Drain Current
25
50
µA
VDS=0.8 x Max Rating, VGS =0V
RDS(on)1
Static Drain-to-Source
…
1.225
1.68
VGS = 12V, ID = 3.5A
On-State Resistance One
VSD
Diode Forward Voltage
…
1.4
1.4
V
TC = 25°C, IS =5.5A,VGS = 0V
International Rectifier Radiation Hardened HEXFETs
are tested to verify their hardness capability. The hard-
ness assurance program at International Rectifier
comprises three radiation environments.
Every manufacturing lot is tested in a low dose rate
(total dose) environment per MIL-STD-750, test
method 1019 condition A. International Rectifier has
imposed a standard gate condition of 12 volts per
note 6 and a V
DS bias condition equal to 80% of the
device rated voltage per note 7. Pre- and post- irra-
diation limits of the devices irradiated to 1 x 105 Rads
(Si) are identical and are presented in Table 1, col-
umn 1, IRHF7230. Post-irradiation limits of the devices
irradiated to 1 x 106 Rads (Si) are presented in Table
1, column 2, IRHF8230. The values in Table 1 will be
met for either of the two low dose rate test circuits that
are used. Both pre- and post-irradiation performance
are tested and specified using the same drive circuitry
and test conditions in order to provide a direct com-
parison.
High dose rate testing may be done on a special
request basis using a dose rate up to 1 x 1012 Rads
(Si)/Sec (See Table 2).
International Rectifier radiation hardened HEXFETs
have been characterized in heavy ion Single Event
Effects (SEE) environments. Single Event Effects char-
acterization is shown in Table 3.
Radiation Characteristics
Table 2. High Dose Rate
ˆ
1011 Rads (Si)/sec 1012 Rads (Si)/sec
Parameter
Min Typ Max
Min Typ Max
Units
Test Conditions
VDSS
Drain-to-Source Voltage
160
160
V
Applied drain-to-source voltage during
gamma-dot
IPP
20
20
A
Peak radiation induced photo-current
di/dt
160
8.0 A/µsec Rate of rise of photo-current
L1
1.0
20
µH
Circuit inductance required to limit di/dt
Table 3. Single Event Effects
LET (Si)
Fluence
Range
VDSBias
VGS Bias
Ion
(MeV/mg/cm2)
(ions/cm2)
(µm)
(V)
(V)
Cu
28
3x 105
~43
180
-5


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