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LM4872IBP Datasheet(PDF) 3 Page - National Semiconductor (TI) |
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LM4872IBP Datasheet(HTML) 3 Page - National Semiconductor (TI) |
3 / 14 page Electrical Characteristics V DD = 2.6V (Notes 1, 2, 8, 9) The following specifications apply for V DD = 2.6V and 8Ω Load unless otherwise specified. Limits apply for TA = 25˚C. (Continued) Symbol Parameter Conditions LM4872 Units (Limits) Typical Limit (Note 6) (Note 7) I SD Shutdown Current V PIN1 =VDD 0.01 µA (max) V OS Output Offset Voltage V IN = 0V 5 mV (max) P 0 Output Power ( 8 Ω ) Output Power ( 4 Ω ) THD = 0.3% (max);f=1kHz THD = 0.5% (max);f=1kHz 0.25 0.5 W W THD+N Total Harmonic Distortion+Noise P o = 0.25 Wrms; AVD =2;20Hz ≤ f ≤ 20 kHz 0.25 % PSRR Power Supply Rejection Ratio V DD = 2.5V to 2.7V 65 dB Note 1: All voltages are measured with respect to the ground pin, unless otherwise specified. Note 2: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is func- tional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which guar- antee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit is given, however, the typical value is a good indication of device performance. Note 3: The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θJA, and the ambient temperature TA. The maximum allowable power dissipation is PDMAX =(TJMAX–TA)/θJA or the number given in Absolute Maximum Ratings, whichever is lower. For the LM4872, TJMAX = 150˚C. The typical junction-to-ambient thermal resistance is 150˚C/W. Note 4: Human body model, 100 pF discharged through a 1.5 k Ω resistor. Note 5: Machine Model, 220 pF–240 pF discharged through all pins. Note 6: Typicals are measured at 25˚C and represent the parametric norm. Note 7: Limits are guaranteed to National’s AOQL (Average Outgoing Quality Level). Note 8: Low Voltage Circuit - See Fig. 4 Note 9: Shutdown current is measured in a Normal Room Environment. Exposure to direct sunlight will increase ISD by a maximum of 2µA. External Components Description (Figure 1) Components Functional Description 1. R i Inverting input resistance which sets the closed-loop gain in conjunction with R f. This resistor also forms a high pass filter with C i at fC= 1/(2π RiCi). 2. C i Input coupling capacitor which blocks the DC voltage at the amplifiers input terminals. Also creates a highpass filter with R i at fc = 1/(2π RiCi). Refer to the section, Proper Selection of External Components, for an explanation of how to determine the value of C i. 3. R f Feedback resistance which sets the closed-loop gain in conjunction with R i. 4. C S Supply bypass capacitor which provides power supply filtering. Refer to the Power Supply Bypassing section for information concerning proper placement and selection of the supply bypass capacitor. 5. C B Bypass pin capacitor which provides half-supply filtering. Refer to the section, Proper Selection of External Components, for information concerning proper placement and selection of C B. www.national.com 3 |
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