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LP3983ITL-1.8 Datasheet(PDF) 8 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Part # LP3983ITL-1.8
Description  Micropower, Low Quiescent Current, CMOS Voltage Regulator in micro SMD Package
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Manufacturer  NSC [National Semiconductor (TI)]
Direct Link  http://www.national.com
Logo NSC - National Semiconductor (TI)

LP3983ITL-1.8 Datasheet(HTML) 8 Page - National Semiconductor (TI)

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Application Hints
POWER DISSIPATION AND DEVICE OPERATION
The permissible power dissipation for any package is a
measure of the capability of the device to pass heat from the
power source, the junctions of the IC, to the ultimate heat
sink, the ambient environment. Thus the power dissipation is
dependent on the ambient temperature and the thermal
resistance across the various interfaces between the die and
ambient air.
As stated in note 3 in the electrical specification section, the
allowable power dissipation for the device in a given pack-
age can be calculated using the equation
P
D =(TJ -TA)/
θ
JA
With a
θ
JA = 255˚C/W, the device in the micro SMD package
returns a value of 392mW with a maximum junction tempera-
ture of 125˚C and an ambient temperature of 25˚C. The
actual power dissipation across the device can be repre-
sented by the following equation;
P
D =(VIN -VOUT)*IOUT
This establishes the relationship between the power dissipa-
tion allowed due to thermal considerations, the voltage drop
across the device, and the continuous current capability of
the device. These two equations should be used to deter-
mine the optimum operating conditions for the device in the
application.
EXTERNAL CAPACITORS
In common with most low-dropout regulators, the LP3983
requires external capacitors to ensure stable operation. The
LP3983 is specifically designed for portable applications
requiring minimum board space and smallest components.
These capacitors must be correctly selected for good perfor-
mance.
INPUT CAPACITOR
An input capacitor is required for stability. It is recommended
that a 1.0uF capacitor be connected between the LP3983
input pin and ground (this capacitance value may be in-
creased without limit).
This capacitor must be located a distance of not more than
1cm from the input pin and returned to a clean analog
ground. Any good quality ceramic, tantalum, or film capacitor
may be used at the input.
Important: Tantalum capacitors can suffer catastrophic fail-
ures due to surge current when connected to a low-
impedance source of power (like a battery or a very large
capacitor). If a tantalum capacitor is used at the input, it must
be guaranteed by the manufacturer to have a surge current
rating sufficient for the application.
There are no requirements for the ESR (Equivalent Series
Resistance) on the input capacitor, but tolerance and tem-
perature coefficient must be considered when selecting the
capacitor to ensure the capacitance will be ) 1µF over the
entire operating temperature range.
OUTPUT CAPACITOR
The LP3983 is designed specifically to work with very small
ceramic output capacitors. A ceramic capacitor (dielectric
types Z5U, Y5V or X7R), recommended value 2.2µF and
with ESR between 5m
Ω to 500mΩ, is suitable in the LP3983
application circuit.
For this device the output capacitor should be connected
between the VOUT pin and ground.
It may also be possible to use tantalum or film capacitors at
the output, but these are not as attractive for reasons of size
and cost (see the section Capacitor Characteristics).
NO-LOAD STABILITY
The LP3983 will remain stable and in regulation with no
external load. This is specially important in CMOS RAM
keep-alive applications.
CAPACITOR CHARACTERISTICS
The LP3983 is designed to work with ceramic capacitors on
the output to take advantage of the benefits they offer. For
capacitance values in the range of 1µF to 4.7µF range,
ceramic capacitors are the smallest, least expensive and
have the lowest ESR values (which makes them best for
eliminating high frequency noise). The ESR of a typical 1µF
ceramic capacitor is in the range of 20 m
Ω to 40 mΩ, which
easily meets the ESR requirement for stability by the
LP3983.
The temperature performance of ceramic capacitors varies
by type. Larger value ceramic capacitors may be manufac-
tured with Z5U or Y5V temperature characteristics, which
results in the capacitance dropping by more than 50% as the
temperature goes from 25˚C to 85˚C.
A better choice for temperature coefficient in a ceramic
capacitor is X7R, which holds the capacitance within ±15%
over the temperature range. Tantalum capacitors are less
desirable than ceramic for use as output capacitors because
they are more expensive when comparing equivalent capaci-
tance and voltage ratings in the 1µF to 4.7µF range.
Another important consideration is that tantalum capacitors
have higher ESR values than equivalent size ceramics. This
means that while it may be possible to find a tantalum
capacitor with an ESR value within the stable range, it would
have to be larger in capacitance (which means bigger and
more costly ) than a ceramic capacitor with the same ESR
value. It should also be noted that the ESR of a typical
tantalum will increase about 2:1 as the temperature goes
from 25˚C down to −40˚C, so some guard band must be
allowed.
ENABLE OPERATION
The LP3983 may be switched ON or OFF by a logic input at
the ENABLE pin, V
EN. A high voltage at this pin will turn the
device on. When the enable pin is low, the regulator output is
off and the device typically consumes < 1µA. If the applica-
tion does not require the shutdown feature, the V
EN pin
should be tied to V
IN to keep the regulator output perma-
nently on. To ensure proper operation, the signal source
used to drive the V
EN input must be able to swing above and
below the specified turn-on/off voltage thresholds listed in
the Electrical Characteristics section under V
IL and VIH.
MICRO SMD MOUNTING
The micro SMD package requires specific mounting tech-
niques which are detailed in National Semiconductor Appli-
cation Note (AN-1112).
Referring to the section Surface Mount Technology (SMT)
Assembly Considerations, it should be noted that the pad
style which must be used with the 5 pin package is NSMD
(non-solder mask defined) type.
For best results during assembly, alignment ordinals on the
PC board may be used to facilitate placement of the micro
SMD device.
www.national.com
8


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