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LPS4018-682ML Datasheet(PDF) 5 Page - ams AG |
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LPS4018-682ML Datasheet(HTML) 5 Page - ams AG |
5 / 26 page ams Datasheet Page 5 [v1-43] 2015-Jul-23 Document Feedback AS1313 − Absolute Maximum Ratings Note(s) and/or Footnote(s): 1. Junction-to-ambient thermal resistance is very dependent on application and board-layout. In situations where high maximum power dissipation exists, special attention must be paid to thermal dissipation during board design. 2. The reflow peak soldering temperature (body temperature) is specified according IPC/JEDEC J-STD-020 “Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices”. Temperature Ranges and Storage Conditions θJA (1) Thermal resistance WL-CSP 95 °C/W MLPD 36 °C/W TAMB Operating temperature -40 85 °C TJ Junction temperature WL-CSP 25 °C MLPD 150 °C TSTRG Storage temperature range -55 125 °C TBODY Package body temperature WL-CSP 260 °C Norm IPC/JEDEC J-STD-020 (2) MLPD Norm IPC/JEDEC J-STD-020 (2) The lead for Pb-free leaded packages is matte tin (100% Sn) RHNC Relative humidity non-condensing 585 % MSL Moisture sensitivity level WL-CSP 1 Represents an unlimited floor life time MLPD 1 Represents an unlimited floor life time Symbol Parameter Min Max Units Comments |
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