Solderable AlGaAs Flip Chip PIN

Rev. V7

MADP-000907-14020x

4

4

MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.

Visit www.macom.com for additional data sheets and product information.

For further information and support please visit:

https://www.macom.com/support

DC-0004063

4

Device Installation Guidelines

Cleanliness

This device should be handled in a clean environment. The chip is resistant to solvents and may be cleaned

using approved industry standard practices and chemicals.

Static Sensitivity

Aluminum Gallium Arsenide PIN diodes are ESD sensitive and can be damaged by static electricity.

Proper ESD handling techniques should be used. These devices are rated Class 1A, (0-250 V) HBM.

General Handling

The die has a BCB, polymer layer which provides scratch protection for the junction area and the anode air

bridge. Die can be handled with plastic tweezers or picked and placed with a #27 tip vacuum pencil.

Assembly Requirements using Electrically Conductive Silver Epoxy

The MADP-000907-14020 is designed to be inserted onto hard or soft substrates with the junction/pad side down.

It may be mounted onto a silk-screened circuit using electrically conductive silver epoxy, approximately 1-2 mils in

thickness and cured at approximately 90°C to 150°C per manufacturer’s schedule. For extended cure times, >30

minutes, temperatures must be kept below 200°C.

Eutectic Solder Die Attached

63/37 Sn/Pb or any RoHS compliant solder may be used for diode attachment. It is recommended that the

attachment surface be preheated to 100°C prior to re-flow in order to minimize CTE mismatches. Gradual

temperature ramp up and ramp down is also recommended with a maximum soldering temperature of 280°C for

less than 10 seconds. See Application Note M538 for recommended soldering profile.