SURMOUNT™ 15 μM PIN Diodes

RoHS Compliant

Rev. V7

MADP-017015-1314

MADP-030015-1314

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DC-0007035

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8. Exceeding these limits may cause in permanent damage.

Parameter

Absolute Maximum

Forward Current

500 mA

Reverse Voltage

-115 V

Operating Temperature

-55°C to +125°C

Storage Temperature

-55 °C to +150°C

Junction Temperature

+175°C

C.W. Incident Power

50 dBm

Mounting Temperature

+280°C for 30 seconds

Handling Procedures

All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin

oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components.

Bulk handling should insure that abrasion and mechanical shock are minimized.

Bonding Techniques

Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are

conveniently located on the bottom surface of these devices and are removed from the active junction locations.

These devices are well suited for solder attachment onto hard and soft substrates. The use of 80Au/20Sn, or

RoHS compliant solders is recommended. For applications where the average power is ~1W, conductive silver

epoxy may also be used. Cure per manufacturers recommended time and temperature. Typically 1 hour at 150°C.

When soldering these devices to a hard substrate, hot gas die bonding is preferred. A vacuum tip pick-up tool and

a force of 60 to100 grams applied to the top surface of the device is recommended. When soldering to soft

substrates, such as Duroid, it is recommended to use a soft solder at the circuit board to mounting pad interface.

Position the die so that its mounting pads are aligned with the circuit board mounting pads. While applying a

downward force perpendicular to the top surface of the die, apply heat near the circuit trace and diode mounting

pad. The solder connection to the two pads should not be made one at a time as this will create unequal heat flow

and thermal stress to the part. Solder reflow should not be performed by causing heat to flow through the top

surface of the die to the back. Since the HMIC glass is transparent, the edges of the mounting pads can be

visually inspected through the die after attachment is completed.

Typical re-flow profiles for Sn60/Pb40 and RoHS compliant solders is provided in Application Note M538,

“Surface Mounting Instructions“ and can viewed on the MACOM website @ www.macom.com