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OPA2314-EP Datasheet(PDF) 8 Page - Texas Instruments |
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OPA2314-EP Datasheet(HTML) 8 Page - Texas Instruments |
8 / 38 page 8 OPA314-Q1, OPA2314-Q1, OPA4314-Q1 SLOS896B – DECEMBER 2014 – REVISED JANUARY 2017 www.ti.com Product Folder Links: OPA314-Q1 OPA2314-Q1 OPA4314-Q1 Submit Documentation Feedback Copyright © 2014–2017, Texas Instruments Incorporated (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. (2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as specified in JESD51-7, in an environment described in JESD51-2a. (3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC- standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. (4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8. (5) The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining RθJA, using a procedure described in JESD51-2a (sections 6 and 7). (6) The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining RθJA, using a procedure described in JESD51-2a (sections 6 and 7). (7) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. 6.5 Thermal Information: OPA2314-Q1 THERMAL METRIC(1) OPA2314-Q1 UNIT DGK (VSSOP) 8 PINS RθJA Junction-to-ambient thermal resistance(2) 138.4 °C/W RθJC(top) Junction-to-case(top) thermal resistance(3) 89.5 °C/W RθJB Junction-to-board thermal resistance(4) 78.6 °C/W ψJT Junction-to-top characterization parameter(5) 29.9 °C/W ψJB Junction-to-board characterization parameter(6) 78.1 °C/W RθJC(bot) Junction-to-case(bottom) thermal resistance(7) N/A °C/W |
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