9

2

3

7

1

12

4

13

11

10

15

14

6

5

6

17.725

12.000

4.000

1.270 (x4)

R0.800

4X 0-80 UNF THRU ALL

5.59

1.59

ITEM

NO.

DESCRIPTION

Material

1

Socket Base

7075-T6 Aluminum Alloy

2

Socket Lid

7075-T6 Aluminum Alloy

3

Compression Plate

7075-T6 Aluminum Alloy

4

Test Chip

PEEK Ceramic filled

5

Alignment Pin 1/32" dia. x 1/8" lng

Chrome Stainless Steel

6

#0-80 x 0.5, SH Cap Screw

Alloy Steel

7

#0-80 Shoulder Screw, 2.29mm thread length

Stainless Steel (303)

8

Ball Guide

Kapton Polyimide/Cirlex

9

Compression Screw M6x1

Stainless Steel (18-8)

10

Backing Plate

7075-T6 Alumium Alloy

11

Elastomer Guide for 10mm IC 0.25mm

Kapton Polyimide/Cirlex

12

IC Guide

Torlon 4203

13

0.25mm thick, 0.05x 0.05mm pitch, 10mm sqr,

Z-axis conductive angled elastomer

20 Micron dia gold plated brass f in silicon,

Thickness: 0.25mm

14

Insulation Plate

FR4 High temp

15

PCB 0.4mm pitch, 21x21 array

Material <not specified>

Ironwood Electronics, Inc.

Tele: (800) 404-0204

www.ironwoodelectronics.com

Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all

other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.

Description: Socket, Backing Plate Detail

Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.

STATUS: Released

REV. A

DATE: 9/11/15

Material: N/A

Finish: N/A

Weight: 9.94

SG25-BGA-2014 Drawing

SCALE: 4:1

SHEET: 4 OF 4

ENG: V. Panavala

FILE: SG25-BGA-2014

DRAWN BY: V. Panavala