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In testing, Cree has found XLamp XB‑H LEDs to be compatible with JEDEC J‑STD‑020C, using the parameters listed below. As a general

guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of the solder paste used.

Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment.

Profile Feature

Lead-Free solder

Average Ramp‑Up Rate (Ts

1.2 °C/second

Preheat: Temperature Min (Ts

120 °C

Preheat: Temperature Max (Ts

170 °C

Preheat: Time (ts

65-150 seconds

Time Maintained Above: Temperature (T

217 °C

Time Maintained Above: Time (t

45‑90 seconds

Peak/Classification Temperature (Tp)

235 ‑ 245 °C

Time Within 5 °C of Actual Peak Temperature (tp)

20‑40 seconds

Ramp‑Down Rate

1 ‑ 6 °C/second

Time 25 °C to Peak Temperature

4 minutes max.

Note: All temperatures refer to topside of the package, measured on the package body surface.

IPC/JEDEC J‑STD‑020C

T

P

T

L

Time

t 25˚C to Peak

Preheat

ts

t

S

t

P

25

Ramp-down

Ramp-up

Critical Zone

T

Ts

max

Ts

min