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ZEN164V130A24LS Datasheet(PDF) 1 Page - Littelfuse |
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ZEN164V130A24LS Datasheet(HTML) 1 Page - Littelfuse |
1 / 9 page PolyZen Polymer Enhanced Zener Diode Micro-Assemblies PRODUCT : ZEN164V130A24LS DOCUMENT: SCD27330 REV LETTER: D REV DATE: JULY 26, 2016 PAGE NO.: 1 OF 10 © 2016 Littelfuse,Inc. littelfuse.com Specifications are subject to change without notice. Revised July 26,2016 Specification Status: Released GENERAL DESCRIPTION Littelfuse PolyZen devices are polymer enhanced, precision Zener diode micro- assemblies. They offer resettable protection against multi-Watt fault events without the need for multi-Watt heat sinks. The Zener diode used for voltage clamping in a PolyZen micro-assembly was selected due to its relatively flat voltage vs current response. This helps improve output voltage clamping, even when input voltage is high and diode currents are large. An advanced feature of the PolyZen micro-assembly is that the Zener diode is thermally coupled to a resistively non- linear, polymer PTC (positive temperature coefficient) layer. This PTC layer is fully integrated into the device, and is electrically in series between VIN and the diode clamped VOUT. This advanced PTC layer responds to either extended diode heating or overcurrent events by transitioning from a low to high resistance state, also known as ”tripping”. A tripped PTC will limit current and generate voltage drop. It helps to protect both the Zener diode and the follow on electronics and effectively increases the diode’s power handling capability. The polymer enhanced Zener diode helps protect sensitive portable electronics from damage caused by inductive voltage spikes, voltage transients, incorrect power supplies and reverse bias. These devices are particularly suitable for portable electronics and other low-power DC devices. BENEFITS Stable Zener diode helps shield downstream electronics from overvoltage and reverse bias Trip events shut out overvoltage and reverse bias sources Analog nature of trip events minimizes upstream inductive spikes Minimal power dissipation requirements Single component placement FEATURES Overvoltage transient suppression Stable VZ vs fault current Time delayed, overvoltage trip Time delayed, reverse bias trip Multi-Watt power handling capability Integrated device construction RoHS Compliant TARGET APPLICATIONS DC power port protection in portable electronics DC power port protection for systems using barrel jacks for power input Internal overvoltage & transient suppression DC output voltage regulation TYPICAL APPLICATION BLOCK DIAGRAM GND V IN V OUT Regulated Output R Load Protected downstream electronics 1 2 3 + Power Supply (External or Internal) PolyZen Protected Electronics PolyZen Device GND V IN V OUT Regulated Output R Load Protected downstream electronics 1 2 3 + Power Supply (External or Internal) PolyZen Protected Electronics GND V IN V OUT Regulated Output R Load Protected downstream electronics 1 2 3 + Power Supply (External or Internal) PolyZen Protected Electronics PolyZen Device |
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