MUN5235DW1, NSBC123JDXV6, NSBC123JDP6

http://onsemi.com

8

PACKAGE DIMENSIONS

SOT−963

CASE 527AD

ISSUE E

DIM

MIN

NOM

MAX

MILLIMETERS

A

0.34

0.37

0.40

b

0.10

0.15

0.20

C

0.07

0.12

0.17

D

0.95

1.00

1.05

E

0.75

0.80

0.85

e

0.35 BSC

0.95

1.00

1.05

E

D

C

A

12 3

4

5

6

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD

FINISH THICKNESS. MINIMUM LEAD

THICKNESS IS THE MINIMUM THICKNESS OF

BASE MATERIAL.

4. DIMENSIONS D AND E DO NOT INCLUDE MOLD

FLASH, PROTRUSIONS, OR GATE BURRS.

X

Y

TOP VIEW

SIDE VIEW

e

b

X

0.08

6X

Y

BOTTOM VIEW

6X

0.35

PITCH

1.20

0.20

DIMENSIONS: MILLIMETERS

RECOMMENDED

PACKAGE

OUTLINE

MOUNTING FOOTPRINT*

L

0.19 REF

L2

0.05

0.10

0.15

L

6X

L2

6X

6X

0.35

*For additional information on our Pb-Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

ON Semiconductor and

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limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications

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