EMC2DXV5T1G, EMC3DXV5T1G, EMC4DXV5T1G, EMC5DXV5T1G

http://onsemi.com

11

PACKAGE DIMENSIONS

SOT−553, 5 LEAD

CASE 463B

ISSUE C

e

M

0.08 (0.003)

X

A

c

−X−

−Y−

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETERS

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH

THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM

THICKNESS OF BASE MATERIAL.

D

E

Y

12

3

4

5

L

1.35

0.0531

0.5

0.0197

mm

inches

SCALE 20:1

0.5

0.0197

1.0

0.0394

0.45

0.0177

0.3

0.0118

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

DIM

A

MIN

NOM

MAX

MIN

MILLIMETERS

0.50

0.55

0.60

0.020

INCHES

b

0.17

0.22

0.27

0.007

c

D

1.55

1.60

1.65

0.061

E

1.15

1.20

1.25

0.045

e

0.50 BSC

L

0.10

0.20

0.30

0.004

0.022

0.024

0.009

0.011

0.063

0.065

0.047

0.049

0.008

0.012

NOM

MAX

1.55

1.60

1.65

0.061

0.063

0.065

0.08

0.13

0.18

0.003

0.005

0.007

0.020 BSC

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