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LF453 Datasheet(PDF) 6 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Part # LF453
Description  LF453 Wide-Bandwidth Dual JFET-Input Operational Amplifiers
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Manufacturer  NSC [National Semiconductor (TI)]
Direct Link  http://www.national.com
Logo NSC - National Semiconductor (TI)

LF453 Datasheet(HTML) 6 Page - National Semiconductor (TI)

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Application Hints
These devices are op amps with an internally trimmed input
offset voltage and JFET input devices (BI-FET II) These
JFETs have large reverse breakdown voltages from gate to
source and drain eliminating the need for clamps across the
inputs Therefore large differential input voltages can easily
be accommodated without a large increase in input current
The maximum differential input voltage is independent of
the supply voltages However neither of the input voltages
should be allowed to exceed the negative supply as this will
cause large currents to flow which can result in a destroyed
unit
Exceeding the negative common-mode limit with the non-in-
verting input or with both inputs will force the output to a
high state potentially causing a reversal of phase to the
output In neither case does a latch occur since raising the
input back within the common-mode range again puts the
input stage and thus the amplifier in a normal operating
mode
Exceeding the positive common-mode limit on a single input
will not change the phase of the output however if both
inputs exceed the limit the output of the amplifier will be
forced to a high state
The amplifiers will operate with a common-mode input volt-
age equal to the positive supply however the gain band-
width and slew rate may be decreased in this condition
When the negative common-mode voltage swings to within
3V of the negative supply an increase in input offset voltage
may occur
Each amplifier is individually biased by a zener reference
which allows normal circuit operation on g5V power sup-
plies Supply voltages less than these may result in lower
gain bandwidth and slew rate
The amplifiers will drivea2kX load resistance to g10V
over the full temperature range of 0 Cto a70 C If the am-
plifier is forced to drive heavier load currents however an
increase in input offset voltage may occur on the negative
voltage swing and finally reach an active current limit on
both positive and negative swings
Precautions should be taken to ensure that the power sup-
ply for the integrated circuit never becomes reversed in po-
larity or that the unit is not inadvertently installed backwards
in a socket as an unlimited current surge through the result-
ing forward diode within the IC could cause fusing of the
internal conductors and result in a destroyed unit
As with most amplifiers care should be taken with lead
dress component placement and supply decoupling in or-
der to ensure stability For example resistors from the out-
put to an input should be placed with the body close to the
input to minimize ‘‘pick-up’’ and maximize the frequency of
the feedback pole by minimizing the capacitance from the
input to ground
A feedback pole is created when the feedback around any
amplifier is resistiveThe parallel resistance and capacitance
from the input of the device (usually the inverting input) to
AC ground set the frequency of the pole In many instances
the frequency of this pole is much greater than the expected
3 dB frequency of the closed loop gain and consequently
there is negligible effect on stability margin However if the
feedback pole is less than approximately 6 times the ex-
pected 3 dB frequency a lead capacitor should be placed
from the output to the input of the op amp The value of the
added capacitor should be such that the RC time constant
of this capacitor and the resistance it parallels is greater
than or equal to the original feedback pole time constant
The benefit of the SO package results from its very small
size It follows however that the die inside the SO package
is less protected from external physical forces than a die in
a standard DIP would be because there is so much less
plastic in the SO Therefore not following certain precau-
tions when board mounting the LF453CM can put mechani-
cal stress on the die lead frame andor bond wires This
can cause shifts in the LF453CM’s parameters even caus-
ing them to exceed limits specified in the Electrical Charac-
teristics For recommended practices in LF453CM surface
mounting refer to Application Note AN450 ‘‘Surface Mount-
ing Methods and Their Effect on Product Reliability’’ and to
the section titled ‘‘Surface Mount’’ found in any Rev 1 Lin-
ear Databook volume
6


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