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AP105-DF59-22P Datasheet(PDF) 10 Page - Hirose Electric |
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AP105-DF59-22P Datasheet(HTML) 10 Page - Hirose Electric |
10 / 12 page 10 DF59 Series●2mm Pitch, Multi Functional Connector System (Floating [Board-to-Board], Swing-Lock [Wire-to-Board], Short-Circuit Pin) Operating Precautions 1. Recommended Temperature Profile (Lead-free soldering possible) 2. Recommended Hand Solder Conditions Soldering iron temperature : 350 ± 10ç, soldering time : within 3 seconds 3. Recommended Screen Thickness, Open Ratio (Pattern Area Ratio) Thickness 0.1mm, Open ratio : 100% 4. Warpage of PC board Maximum of 0.02mm at the connector center, with both ends of the connector as reference points. 5. Cleaning Condition Cleaning with IPA is possible. (Cleaning is not recommended. In case of cleaning, please evaluate if it causes a decrease in the performance which includes mechanical operation and environmental resistance.) 6. Precautions ■ When inserting crimp-type (solderless) terminals to crimping (solderless) sockets, to maintain reliable performance, please do not insert obliquely. ■ DO NOT mate/un-mate a non-terminated plug with a non-mounted receptacles. This may lead to damage or deformation of the contacts. ■ Please note that pulling on the wires or cable during un-mating may cause damage. ■ DO NOT apply flux to the contact terminals when hand soldering the receptacle to the board. Flux can wick into the electrical contact areas and may lead to connection failures. ■ Slight discoloration on the insulating materials will not affect form, fit or function of the connectors. ■ Please refer to the following for the points for proper handling regarding mating/unmating operations. “DF59 Insertion and Removal Manual” “DF59S Insertion and Removal Manual” ATAD-H0651 “DF59SN Insertion and Removal Manual” ATAD-H0719 “DF59M Operation manual” ATAD-H0779 [Applicable Conditions] 1. Peak Temperature : MAX 250ç 2. Heated Area : 220ç or above, within 60 sec. 3. Pre-heating Area : 150 to 180ç, 90 to 120 sec. 4. Number of Times : within 2 times *Measured at contact lead area Please be noted that the reflow condition may vary depending on soldering paste type, manufacturer of soldering material, board size, as well as conditions of other mounting materials. (*1) Above temperature profile is our recommended value. 50 60sec MAX 100 150 200 250 0 PRE-HEATING TIME SOLDERING TIME TIME(sec) 90 − 120sec 180ç 220ç 10sec MAX MAX 250ç |
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