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DF65-2428SCF Datasheet(PDF) 5 Page - Hirose Electric |
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DF65-2428SCF Datasheet(HTML) 5 Page - Hirose Electric |
5 / 8 page 5 DF61Y Series●Small-Sized, Low Profile Wire-to-Board Connector for Power Supply BOperating Precautions 1. Recommended Temperature Profile (Lead-free soldering possible) 2. Recommended Hand Solder Conditions Soldering iron temperature : 350±10 ℃, soldering time : within 3 seconds 3. Recommended Screen Thickness, Aperture Opening Rate (Pattern Area Ratio) Thickness 0.1mm, aperture opening rate : 100% 4. PCB Warpage 0.02mm Max at the center of connector with the both edges of the connector as the baseline 5. Cleaning Condition Cleaning with IPA is possible. (Cleaning is not recommended as it may change the feel of insertion/extraction, etc. Please consult with us when using other types of cleaning agents.) 6. Precautions ■ Insertion/extraction of the connector while not mounted to the PCB may cause breakage or deformation to the contact. ■ Do not apply flux at the time of hand soldering, as it may result in flux rise. ■ This product may have slightly different hue on molded items, however, they do not affect the product performance. ■ See the separate “DF61Y Insertion/Extraction Procedure Manual” for handling precautions at the time of insertion and extraction. [Applicable Conditions] 1. Peak Temperature : MAX 250ç 2. Heated Area : 220ç or above, within 60 sec. 3. Pre-heating Area : 150 to 180ç, 90 to 120 sec. 4. Number of Operation : Twice or less * The contact lead area was measured. The conditions may change depending on the types and manufacturers of cream solder, PCB size, and conditions of other materials used for soldering. Please fully check the soldering condition before use. [Remarks 1] This temperature profile is our recommended value. MAX 250ç 10sec MAX 60sec MAX 90 to 120sec PRE-HEATING TIME SOLDERINGTIME 0 50 100 150 180ç 220ç 200 250 TIME (sec.) |
Similar Part No. - DF65-2428SCF |
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Similar Description - DF65-2428SCF |
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