MUN531335DW1

www.onsemi.com

7

PACKAGE DIMENSIONS

SC−88/SC70−6/SOT−363

CASE 419B−02

ISSUE Y

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,

PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRU-

SIONS, OR GATE BURRS SHALL NOT EXCEED 0.20 PER END.

4. DIMENSIONS D AND E1 AT THE OUTERMOST EXTREMES OF

THE PLASTIC BODY AND DATUM H.

5. DATUMS A AND B ARE DETERMINED AT DATUM H.

6. DIMENSIONS b AND c APPLY TO THE FLAT SECTION OF THE

LEAD BETWEEN 0.08 AND 0.15 FROM THE TIP.

7. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION.

ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 TOTAL IN

EXCESS OF DIMENSION b AT MAXIMUM MATERIAL CONDI-

TION. THE DAMBAR CANNOT BE LOCATED ON THE LOWER

RADIUS OF THE FOOT.

C

12

3

A1

A

c

65

4

E

b

6X

DIM

MIN

NOM

MAX

MILLIMETERS

A

−−−

−−−

1.10

A1

0.00

−−−

0.10

ddd

b

0.15

0.20

0.25

C

0.08

0.15

0.22

D

1.80

2.00

2.20

−−−

−−−

0.043

0.000

−−−

0.004

0.006

0.008

0.010

0.003

0.006

0.009

0.070

0.078

0.086

MIN

NOM

MAX

INCHES

0.10

0.004

E1

1.15

1.25

1.35

e

0.65 BSC

L

0.26

0.36

0.46

2.00

2.10

2.20

0.045

0.049

0.053

0.026 BSC

0.010

0.014

0.018

0.078

0.082

0.086

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.65

0.66

6X

DIMENSIONS: MILLIMETERS

0.30

PITCH

2.50

6X

RECOMMENDED

TOP VIEW

SIDE VIEW

END VIEW

bbb H

B

SEATING

PLANE

DETAIL A

E

A2

0.70

0.90

1.00

0.027

0.035

0.039

L2

0.15 BSC

0.006 BSC

aaa

0.15

0.006

bbb

0.30

0.012

ccc

0.10

0.004

A-B D

aaa C

2X 3 TIPS

D

E1

D

e

A

2X

aaa H D

2X

D

L

PLANE

DETAIL A

H

GAGE

L2

C

ccc C

A2

6X

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