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7007L35JG Datasheet(PDF) 8 Page - Integrated Device Technology |
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7007L35JG Datasheet(HTML) 8 Page - Integrated Device Technology |
8 / 22 page IDT7007S/L High-Speed 32K x 8 Dual-Port Static RAM Military, Industrial and Commercial Temperature Ranges 8 NOTES: 1. Transition is measured 0mV from Low- or High-impedance voltage with Output Test Load (Figure 2). 2. This parameter is guaranteed by device characterization, but is not production tested. 3. To access RAM, CE = VIL and SEM = VIH. To access semaphore, CE = VIH and SEM = VIL. 4. 'X' in part numbers indicates power rating (S or L). AC Electrical Characteristics Over the Operating Temperature and Supply Voltage Range(4) AC Test Conditions Figure 2. Output Test Load (for tLZ, tHZ, tWZ, tOW) * Including scope and jig. Input Pulse Levels Input Rise/Fall Times Input Timing Reference Levels Output Reference Levels Output Load GND to 3.0V 5ns Max. 1.5V 1.5V Figures 1 and 2 2940 tbl 11 Figure 1. AC Output Test Load 2940 drw 06 893 Ω 30pF 347 Ω 5V DATAOUT BUSY INT 893 Ω 5pF* 347 Ω 5V DATAOUT 2940 drw 05 7007X15 Com'l Only 7007X20 Com'l & Ind 7007X25 Com'l, Ind & Military Unit Symbol Parameter Min.Max. Min.Max.Min. Max. READ CYCLE tRC Read Cycle Time 15 ____ 20 ____ 25 ____ ns tAA Address Access Time ____ 15 ____ 20 ____ 25 ns tACE Chip Enable Access Time(3) ____ 15 ____ 20 ____ 25 ns tAOE Output Enable Access Time ____ 10 ____ 12 ____ 13 ns tOH Output Hold from Address Change 3 ____ 3 ____ 3 ____ ns tLZ Output Low-Z Time(1,2) 3 ____ 3 ____ 3 ____ ns tHZ Output High-Z Time(1,2) ____ 10 ____ 12 ____ 15 ns tPU Chip Enable to Power Up Time(2) 0 ____ 0 ____ 0 ____ ns tPD Chip Disable to Power Down Time(2) ____ 15 ____ 20 ____ 25 ns tSOP Semaphore Flag Update Pulse (OE or SEM)10 ____ 10 ____ 12 ____ ns tSAA Semaphore Address Access Time ____ 15 ____ 20 ____ 25 ns 2940 tbl 12a 7007X35 Com'l, Ind & Military 7007X55 Com'l, Ind & Military Unit Symbol Parameter Min.Max.Min.Max. READ CYCLE tRC Read Cycle Time 35 ____ 55 ____ ns tAA Address Access Time ____ 35 ____ 55 ns tACE Chip Enable Access Time(3) ____ 35 ____ 55 ns tAOE Output Enable Access Time ____ 20 ____ 30 ns tOH Output Hold from Address Change 3 ____ 3 ____ ns tLZ Output Low-Z Time(1,2) 3 ____ 3 ____ ns tHZ Output High-Z Time(1,2) ____ 15 ____ 25 ns tPU Chip Enable to Power Up Time(2) 0 ____ 0 ____ ns tPD Chip Disable to Power Down Time(2) ____ 35 ____ 50 ns tSOP Semaphore Flag Update Pulse (OE or SEM)15 ____ 15 ____ ns tSAA Semaphore Address Access Time ____ 35 ____ 55 ns 2940 tbl 12b |
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