If Military/Aerospace specified devices are required,

please contact the National Semiconductor Sales Office/

Distributors for availability and specifications.

Supply Voltage

(LM386N-1, -3, LM386M-1)

15V

Supply Voltage (LM386N-4)

22V

Package Dissipation (Note 3)

(LM386N)

1.25W

(LM386M)

0.73W

(LM386MM-1)

0.595W

Input Voltage

Storage Temperature

−65˚C to +150˚C

Operating Temperature

0˚C to +70˚C

Junction Temperature

+150˚C

Soldering Information

Dual-In-Line Package

Soldering (10 sec)

+260˚C

Small Outline Package

(SOIC and MSOP)

Vapor Phase (60 sec)

+215˚C

Infrared (15 sec)

+220˚C

See AN-450 “Surface Mounting Methods and Their Effect

on Product Reliability” for other methods of soldering

surface mount devices.

Thermal Resistance

θ

37˚C/W

θ

107˚C/W

θ

35˚C/W

θ

172˚C/W

θ

210˚C/W

θ

56˚C/W

T

Parameter

Conditions

Min

Typ

Max

Units

Operating Supply Voltage (V

LM386N-1, -3, LM386M-1, LM386MM-1

4

12

V

LM386N-4

518

V

Quiescent Current (I

8

mA

Output Power (P

LM386N-1, LM386M-1, LM386MM-1

V

250

325

mW

LM386N-3

V

500

700

mW

LM386N-4

V

700

1000

mW

Voltage Gain (A

26

dB

10 µF from Pin 1 to 8

46

dB

Bandwidth (BW)

V

300

kHz

Total Harmonic Distortion (THD)

V

0.2

%

f = 1 kHz, Pins 1 and 8 Open

Power Supply Rejection Ratio (PSRR)

V

50

dB

Pins 1 and 8 Open, Referred to Output

Input Resistance (R

50

k

Ω

Input Bias Current (I

250

nA

Note 1: All voltages are measured with respect to the ground pin, unless otherwise specified.

Note 2: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is func-

tional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which guar-

antee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit is

given, however, the typical value is a good indication of device performance.

Note 3: For operation in ambient temperatures above 25˚C, the device must be derated based on a 150˚C maximum junction temperature and 1) a thermal resis-

tance of 107˚C/W junction to ambient for the dual-in-line package and 2) a thermal resistance of 170˚C/W for the small outline package.

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