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LYY876-Q2T1-26 Datasheet(PDF) 11 Page - OSRAM GmbH

Part No. LYY876-Q2T1-26
Description  white SMT package
Download  20 Pages
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Maker  OSRAM [OSRAM GmbH]
Homepage  http://www.osram.com
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 11 page
background image
Version 1.1
LY Y876
2014-10-16
11
Recommended Solder Pad 9) page 19
Reflow soldering
Empfohlenes Lötpaddesign 9) Seite 19
Reflow-Löten
Note:
For superior solder joint connectivity results we
recommend soldering under standard nitrogen
atmosphere. Package not suitable for ultra
sonic cleaning.
Anm.:
Um eine verbesserte Lötstellenkontaktierung zu
erreichen, empfehlen wir, unter Standard-
Stickstoffatmosphäre zu löten. Das Gehäuse ist
für Ultraschallreinigung nicht geeignet.
OHPY1315
0.8 (0.031)
Component location on pad
Bauteil positioniert
Padgeometrie für
C
A
verbesserte Wärmeableitung
heat dissipation
Paddesign for improved
Lötstopplack
Solder resist
C
A




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