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LM3700XCBPX-308 Datasheet(PDF) 8 Page - National Semiconductor (TI) |
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LM3700XCBPX-308 Datasheet(HTML) 8 Page - National Semiconductor (TI) |
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8 / 12 page  Typical Performance Characteristics (Continued) Low-Line Comparator Propagation Delay vs Temperature 20011414 Circuit Information Reset Output The Reset input of a µP initializes the device into a known state. The LM3700/LM3701 microprocessor supervisory cir- cuits assert a forced reset output to prevent code execution errors during power-up, power-down, and brownout condi- tions. RESET is guaranteed valid for V CC > 1V. Once VCC ex- ceeds the reset threshold, an internal timer maintains the output for the reset timeout period. After this interval, reset goes high. The LM3700 offers an active-low RESET; The LM3701 offers an active-high RESET. Any time V CC drops below the reset threshold (such as during a brownout), the reset activates. When V CC again rises above the reset threshold, the internal timer starts. Reset holds until V CC exceeds the reset threshold for longer than the reset timeout period. After this time, reset releases. Reset Threshold The LM3700/LM3701 family is available with a reset voltage of 3.08V. Other reset thresholds in the 2.20V to 5.0V range, in steps of 10 mV, are available; contact National Semicon- ductor for details. Low-Line Output (LLO) The low-line output comparator is typically used to provide a non-maskable interrupt to a µP when V CC begins falling. LLO monitors V CC and goes low when VCC falls below VLLOT (typically 1.02 • V RST) with hysteresis of 0.0032 • VRST. Special Precautions for the micro SMD Package As with most integrated circuits, the LM3700 and LM3701 are sensitive to exposure from visible and infrared (IR) light radiation. Unlike a plastic encapsulated IC, the micro SMD package has very limited shielding from light, and some sensitivity to light reflected from the surface of the PC board or long wavelength IR entering the die from the side may be experienced. This light could have an unpredictable affect on the electrical performance of the IC. Care should be taken to shield the device from direct exposure to bright visible or IR light during operation. Micro SMD Mounting The micro SMD package requires specific mounting tech- niques which are detailed in National Semiconductor Appli- cation Note AN-1112. Referring to the section Surface Mount Technology (SMT) Assembly Considerations,it should be noted that the pad style which must be used with the 9-pin package is the NSMD (non-solder mask defined) type. For best results during assembly, alignment ordinals on the PC board may be used to facilitate placement of the micro SMD device. www.national.com 8 |
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