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LSY876-P2S1-1 Datasheet(PDF) 11 Page - OSRAM GmbH |
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LSY876-P2S1-1 Datasheet(HTML) 11 Page - OSRAM GmbH |
11 / 20 page Version 1.1 LS Y876 2014-10-16 11 Recommended Solder Pad 9) page 19 Reflow soldering Empfohlenes Lötpaddesign 9) Seite 19 Reflow-Löten Note: For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning. Anm.: Um eine verbesserte Lötstellenkontaktierung zu erreichen, empfehlen wir, unter Standard- Stickstoffatmosphäre zu löten. Das Gehäuse ist für Ultraschallreinigung nicht geeignet. OHPY1315 0.8 (0.031) Component location on pad Bauteil positioniert Padgeometrie für C A verbesserte Wärmeableitung heat dissipation Paddesign for improved Lötstopplack Solder resist C A |
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