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ISO7821LLS

SLLSET5A – MARCH 2016 – REVISED SEPTEMBER 2016

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Copyright © 2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values except differential I/O bus voltages are with respect to the local ground pin (GND1 or GND2) and are peak voltage

values.

(3)

Maximum voltage must not exceed 6 V.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

–0.5

6

V

V

Voltage on input, output, and

enable pins

OUTx, INx, ENx

–0.5

(3)

V

Maximum current through OUTx pins

–20

20

mA

Junction temperature

–55

150

°C

Storage temperature

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic

discharge

±4500

V

±1500

6.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

Supply voltage

3

3.3

5.5

V

Magnitude of RX input

differential voltage

Driven with voltage sources on RX pins

100

600

mV

RX input common-

mode voltage

V

TX far-end differential termination

100

Ω

DR

Signaling rate

50

150

Mbps

Ambient temperature

–55

25

125

°C