4

DRV401-Q1

SBOS814 – DECEMBER 2016

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Copyright © 2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted).

(1)

MIN

MAX

UNIT

Voltage

Supply voltage

7

V

Signal input pin

−0.5

Differential amplifier

Signal input pin

–10

10

Current

Signal input pin, IS1 and IS2

–75

75

mA

Pins other than IS1 and IS2

–25

25

0

250

Temperature

–50

150

°C

150

–55

150

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification

6.2 ESD Ratings

VALUE

UNIT

Electrostatic

discharge

±1000

V

All other pins

±5000

Charged-device model (CDM), per AEC Q100-011

All pins

±1000

Corner pins

±1000

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

4.5

5

5.5

V

Specified temperature range

–40

25

+125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

over operating free-air temperature range (unless otherwise noted)

DRV401-Q1

UNIT

RGW

(VQFN)

20 PINS

Junction-to-ambient thermal resistance

34.1

°C/W

Junction-to-case (top) thermal resistance

22.8

°C/W

Junction-to-board thermal resistance

12.1

°C/W

Junction-to-top characterization parameter

0.3

°C/W

Junction-to-board characterization parameter

12.0

°C/W

Junction-to-case (bottom) thermal resistance

3.5

°C/W