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TPS65132BYFFR Datasheet(PDF) 8 Page - Texas Instruments |
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TPS65132BYFFR Datasheet(HTML) 8 Page - Texas Instruments |
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8 / 65 page  8 TPS65132 SLVSBM1H – JUNE 2013 – REVISED NOVEMBER 2016 www.ti.com Product Folder Links: TPS65132 Submit Documentation Feedback Copyright © 2013–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to ground. 7 Specifications 7.1 Absolute Maximum Ratings(1)(2) over operating free-air temperature range (unless otherwise noted) VALUE UNIT MIN MAX Voltage range CFLY1, EN, ENN, ENP, OUTP, REG, SCL, SDA, SW, SYNC, VIN –0.3 7 V CFLY2, OUTN –7 0.3 V Continuous total power dissipation See Thermal Information Operating junction temperature, TJ –40 150 °C Operating ambient temperature, TA –40 85 °C Storage temperature, Tstg –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.2 ESD Ratings VALUE UNIT VESD Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V Charged device model (CDM) per JEDEC specification JESD22- C101, all pins(2) ±500 V (1) Please see Detailed Description section for further information. (2) X7R (or better dielectric material) is recommended. 7.3 Recommended Operating Conditions MIN TYP MAX UNIT VIN Input voltage range 2.5 5.5 V L Inductor(1) 2.2 4.7 µH CIN Input capacitor(1)(2) 4.7 µF CFLY Flying capacitor(1)(2) 2.2 µF COUTP, COUTN, CREG Output capacitors(1)(2) 4.7 µF TA Operating ambient temperature –40 85 °C TJ Operating junction temperature –40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 7.4 Thermal Information THERMAL METRIC(1) TPS65132 TPS65132 UNIT YFF RVC (15) BALLS (20) PINS RθJA Junction-to-ambient thermal resistance 76.5 39.0 °C/W RθJCtop Junction-to-case (top) thermal resistance 0.2 42.7 °C/W RθJB Junction-to-board thermal resistance 44 13.6 °C/W ψJT Junction-to-top characterization parameter 1.6 0.6 °C/W ψJB Junction-to-board characterization parameter 43.4 13.6 °C/W RθJCbot Junction-to-case (bottom) thermal resistance N/A 3.8 °C/W |
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